Carrying method for cleaning wafer after CMP

A post-cleaning and wafer technology, applied in the direction of conveyor objects, electrical components, transportation and packaging, etc., can solve the problems of long transportation time, cleaning capacity can not meet high demand, low cleaning method transportation efficiency, etc., to reduce transportation time, improve cleaning efficiency, and increase productivity

Pending Publication Date: 2021-04-09
若名芯半导体科技(苏州)有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing cleaning method generally uses the manipulator to place the CMP wafer on the carrier, and then uses the manipulator to transport the wafers one by one to each cleaning mechanism for direct cleaning, so that although the wafer can be cleaned Clean, but after a long period of actual processing, it is found that the cleaning method of wafer handling is low in efficiency and long in handling time, resulting in the cleaning capacity not meeting high demand, which seriously restricts the further development of wafers

Method used

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  • Carrying method for cleaning wafer after CMP
  • Carrying method for cleaning wafer after CMP
  • Carrying method for cleaning wafer after CMP

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Please refer to the attached figure 1 , in the transfer method for post-CMP cleaning of wafers described in the embodiment of the present invention, it includes a transfer unit 1 , a first cleaning unit 2 , a second cleaning unit 3 , a double manipulator 4 and a loading table 6 .

[0029] Specifically, the handover unit 1 mainly plays the role of handover with the wafers after CMP in the previous process, accepts the wafers processed by CMP, and pre-cleanes these wafers; wherein, the operation process of pre-cleaning In order to immerse the wafers in ozone water and clean them by ultrasonic waves, the wafers here are immersed in ozone water in groups of two, while ensuring that the wafers are in a wet state.

[0030] Wherein, the cleaning process of the first cleaning unit is as follows: when the brush rotates, the wafer is brushed with pure water and alkaline chemical solution in sequence; the cleaning process of the second cleaning unit is as follows: the nozzle seque...

Embodiment 2

[0043] The invention discloses a method for transporting various wafers after CMP cleaning, which comprises the following steps:

[0044] Step S01 , the handover unit receives the wafer after CMP and performs moisturizing.

[0045] Step S02 , the double manipulators transport the first wafer 10 in the transfer unit to the first cleaning unit for cleaning with a brush combined with pure water and alkaline liquid for 130 seconds.

[0046] Step S03 , the double manipulators transport the first wafer 10 after the first cleaning to the second cleaning unit, spray nozzles with ozone and acidic liquid, and then dry it. This process takes 190 seconds.

[0047] Step S04, the double manipulator returns to the handover unit, and transfers the second wafer 20 in the handover unit to the first cleaning unit for the first cleaning for 130 seconds. At this time, the first wafer 10 is cleaned in the second cleaning unit .

[0048]Step S05, when the second wafer 20 continues to be moisturize...

Embodiment 3

[0052] Please refer to the attached Figure 4 The difference between this embodiment and Embodiment 1 is that a temporary storage unit 5 is installed between the loading table and the second cleaning unit for storing wafers that cannot be placed after cleaning by the second cleaning unit 4 .

[0053] The invention discloses a method for transporting various wafers after CMP cleaning, which comprises the following steps:

[0054] Step S01 , the handover unit receives the wafer after CMP and performs moisturizing.

[0055] Step S02 , the dual manipulators transport the first wafer in the delivery unit to the first cleaning unit for cleaning with a brush combined with pure water and alkaline chemical solution for 120 seconds.

[0056] Step S03 , the double manipulators transport the first wafer after the first cleaning to the second cleaning unit for spray cleaning with nozzles combined with ozone and acidic liquid, and then dry it. This process takes 180 seconds.

[0057] Step...

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PUM

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Abstract

The invention relates to a carrying method for cleaning a wafer after CMP. The carrying method comprises the following steps that S01, a handover unit receives the wafer after CMP; S02, double manipulators carry the first wafer in the handover unit to a first cleaning unit to be cleaned for the first time; S03, the double manipulators carry the first wafer to a second cleaning unit to be cleaned for the second time; S04, the double manipulators carry the second wafer in the handover unit to the first cleaning unit to be cleaned for the first time; S05, the second wafer waits for moisture preservation after being cleaned by the first cleaning unit, and enters a second cleaning unit before the first wafer is cleaned for the second time; S06, the positions of the first wafer and the second wafer are exchanged through the double manipulators, the second wafer is cleaned in the second cleaning unit, and the first wafer is conveyed into a wafer box of the loading table; and S07, step S02 and step S06 are repeated, and the wafers are sequentially put into the wafer boxes. The carrying time of the wafers is effectively shortened, and the productivity is improved.

Description

technical field [0001] The invention belongs to the related technical field of wafer cleaning, and in particular relates to a transfer method for post-CMP cleaning of wafers. Background technique [0002] Wafer cleaning is a very important step in the production process of semiconductor devices. Whether the cleaning is clean or not directly affects the performance and yield of the device. Therefore, in the manufacturing process of semiconductor devices, the wafer needs to be cleaned many times. In the existing semiconductor manufacturing process, the chemical mechanical polishing (CMP) method is generally used for the planarization process. However, many residues (residue) will be generated during the CMP process, thereby forming defects (defects). Therefore, after CMP, the wafer (wafer) needs to be cleaned to reduce defects. [0003] The existing cleaning method generally uses the manipulator to place the CMP wafer on the carrier, and then uses the manipulator to transport...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677H01L21/67
CPCH01L21/67703H01L21/67706H01L21/6704
Inventor 余涛朴灵绪郭巍
Owner 若名芯半导体科技(苏州)有限公司
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