SOI-based LDMOS device based on flexible substrate and manufacturing method thereof
A flexible substrate and device technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve the problem of low mobility
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[0053] Below in conjunction with accompanying drawing, further describe the present invention in detail through embodiment.
[0054] Such as figure 1 As shown, an SOI (Silicon-On-Insulator)-based lateral double-diffused metal-oxide-semiconductor field effect transistor (LDMOS) applied to a flexible electronic system has a structure of:
[0055] Substrate 1 of flexible material; PDMS, PET, PI, PEN and other flexible materials can be used, and the substrate thickness of the flexible material is 200-500 μm;
[0056] The P-type silicon layer 2 located on the surface of the substrate has a thickness of 2-10 μm;
[0057] The SOI base 3 located on the surface of the P-type silicon layer has a thickness of 1-3 μm;
[0058] The base region 13 and the drift region 4 formed by the epitaxial layer on the SOI base are relatively on the left and right sides respectively, with a thickness of 1-2 μm;
[0059] The source region formed on top of the base region is composed of P + District 1...
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