A kind of diamond abrasive liquid for wafer substrate

Abstract

The invention discloses a diamond grinding liquid used for wafer substrates, which belongs to the technical field of fine chemicals. The addition of the alcohol ether organic solvent in the grinding liquid reduces the surface tension of the grinding liquid and increases the wetting and penetrating ability. The molecular structure of the multifunctional metal ion scavenger contains an amide functional group, and the amide bond is connected with an oxygen atom. The synergistic effect of the metal ion scavenger and the organic solvent can significantly reduce the adsorption force of the grinding debris to the surface and edge of the wafer, which is easy to be washed and avoids bringing the grinding debris into the wax removal tank. And the high-performance dispersant is used to uniformly disperse the diamond powder, so that the grinding liquid has good dispersion stability.

Description

technical field [0001] The invention relates to the field of grinding fluids, in particular to a diamond grinding fluid which is easy to clean after grinding, and belongs to the field of fine chemicals. Background technique [0002] Diamond abrasive liquid is prepared by dispersing abrasive grains in the medium. It is a grinding product with excellent chemical and mechanical properties. It can be used for grinding silicon wafers, engineering ceramics, compound crystals, precision optical devices, liquid crystal panels, gemstones, metal workpieces, etc. polishing. [0003] After the grinding and polishing process in the wafer substrate manufacturing process, it is necessary to clean the residues of abrasive particles, organic matter, and metal oxides. The cleaning effect has an important impact on the back-end process, so not only does it have higher requirements for the cleaning agent after grinding, but it also puts forward new requirements for the easy cleaning ability of...

AI Technical Summary

Problems solved by technology

If the grinding debris in this step is not easy to be washed by water, it will be taken to the wax removal tank, causing contamination of the electrode

[0004] At present, commonly used diamond grinding liquids usually use mixed alkane solvents such as white oil, kerosene, etc. This type of grinding liquid has the advantages of high removal rate and low cost. High cost; in addition, water-based abrasives such as ethylene glycol, ethanol, propylene glycol, glycerol, etc. can also be used. The edge of the chip is easy to absorb dirt such as wear debris and is not easy to be cleaned, and it is easy to be taken to the wax removal tank, causing electrode pollution and affecting LED quality, etc.

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