Antistatic photosensitive resin for photocuring rapid prototyping and preparation method and application thereof

A photosensitive resin, antistatic technology, used in the field of 3D printing

Active Publication Date: 2021-04-20
SUN YAT SEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to overcome the lack of photosensitive resin compositions for special

Method used

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  • Antistatic photosensitive resin for photocuring rapid prototyping and preparation method and application thereof
  • Antistatic photosensitive resin for photocuring rapid prototyping and preparation method and application thereof
  • Antistatic photosensitive resin for photocuring rapid prototyping and preparation method and application thereof

Examples

Experimental program
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Effect test

preparation example Construction

[0062] Among them, in the preparation process of modified multi-walled carbon nanotube 1#, hyperbranched epoxy resin HyPerE102 was selected; in the preparation process of modified multi-walled carbon nanotube 2#, hyperbranched epoxy resin HyPerDE1050 was selected.

[0063] The antistatic photosensitive resins of the various embodiments of the present invention and comparative examples are prepared through the following processes: cationic photocurable components, free radical photocurable components, cationic photoinitiators, free radical photoinitiators, modified multi-walled carbon nanotubes Stir and mix with antioxidant at 25°C for 60 minutes to obtain.

[0064] Wherein, the test method of each performance index of each embodiment and comparative example is as follows:

[0065] 1) Critical exposure energy E c and curing depth D p The test: using the SLA 3D printer, in the known laser power P L , laser scanning interval h s case, using different laser scan rates V s , f...

Embodiment 1~7 and comparative example 1~5

[0075] The present embodiment and comparative example provide a series of antistatic photosensitive resins, the formulations of which are listed in Table 1 below.

[0076] The formula (part) of table 2 embodiment 1~7 and comparative example 1~4

[0077]

[0078] In addition, a commercially available white material was used as Comparative Example 5.

[0079] According to the method mentioned above, the properties of the antistatic photosensitive resins of the various examples and comparative examples were measured, and the results are shown in Table 2.

[0080] The performance test result of each embodiment and comparative example of table 2

[0081]

[0082] It can be seen from Table 2 that the antistatic photosensitive resin provided by each embodiment of the present invention has a good antistatic effect under the addition of a very low conductive agent, and the surface resistance value of the cured product is far lower than 10 9 Ω, low viscosity, excellent mechanica...

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Abstract

The invention relates to antistatic photosensitive resin for photocuring rapid forming and a preparation method and application thereof. The antistatic photosensitive resin comprises a cationic photocuring component, a free radical photocuring component, a cationic photoinitiator, a free radical photoinitiator, a modified multi-walled carbon nanotube, hyperbranched epoxy resin and an antioxidant. The antistatic photosensitive resin provided by the invention has the advantages of better antistatic effect, low viscosity, extremely low conductive agent addition amount, better photocuring activity of a resin system, excellent mechanical properties of a resin curing material, good toughness, uniform resistance value, and good surface precision and dimensional stability of a printed piece, and the surface resistance value of a cured product is lower than 10<9> ohms.

Description

technical field [0001] The invention belongs to the technical field of 3D printing, and in particular relates to an antistatic photosensitive resin for photocuring rapid prototyping, a preparation method and application thereof. Background technique [0002] Light-curing rapid prototyping technology (SLA) is the first rapid prototyping technology put into commercial application. Its specific working principle is as follows: use a computer program to control the ultraviolet laser to scan and move on the surface of the photosensitive resin, so that the photosensitive resin is cured to form a model. single layer. After each layer of photosensitive resin is cured, the curing platform will move a thickness of a single layer, and then the resin will fill the formed space through automatic flow or passive smearing, and then cure again. Repeat this to get the formed parts. Stereo-curing rapid prototyping technology can precisely control laser movement, has the advantages of low en...

Claims

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Application Information

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IPC IPC(8): C08F283/10C08F222/20C08F222/14C08F2/48C08K9/02C08K9/06C08K9/04C08K3/04C08K5/134C08K5/526B33Y70/10
Inventor 雷周桥许卫民容敏智
Owner SUN YAT SEN UNIV
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