Chopper, wire bonding equipment and wire bonding method
A kind of technology of equipment and chopper, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of large size of metal balls and unfavorable improvement of integration degree, and achieve height increase, increase of taper, and improvement of shape Effect
Pending Publication Date: 2021-04-20
SJ SEMICON JIANGYIN CORP
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Problems solved by technology
[0004] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a chopper, a wire bonding device and a wire bonding method, which are used to solve the problem that the size of the metal ball formed at the end of the metal wire in the prior art is large, which is not conducive to integration. problem of heightened
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[0028] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.
[0029] For example, when describing the embodiments of the present invention in detail, for the convenience of explanation, the cross-sectional view showing the device structure will not be partially enlarged according to the general scale, and the schematic diagram is only an example, which should not limit the protection scope of the present invention. In addition, the three-dimensional space dimensions of length, width and depth sho...
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Abstract
The invention provides a chopper, wire bonding equipment and a wire bonding method. The chopper comprises a conical part and a bottleneck part, the bottleneck part is connected to the tail end of the conical part, the conical part and the bottleneck part are provided with wire holes for a metal wire to pass through, and the included angle between the end surface of the bottleneck part and the horizontal plane is not greater than 5 DEG. The chopper of the wire bonding equipment is improved, the bottleneck part of the chopper is designed to be rectangular, the inclination angle of the tail end of the bottleneck part is greatly reduced, the size of the metal ball is greatly reduced and ranges from 140 [mu]m to 160 [mu]m, the requirement of the vertical wire bonding process for the size of a metal wire can be met, and the integration level of wafer-level packaging is effectively improved.
Description
technical field [0001] The invention belongs to the field of semiconductor manufacturing equipment, in particular to a chopper, wire bonding equipment and a wire bonding method. Background technique [0002] In recent years, "faster, smaller, cheaper, and more reliable" has become the goal driving the development of the semiconductor technology field. In the field of semiconductor manufacturing, the density of integrated circuits is increased by continuously reducing the minimum feature size and increasing packaging stacks to meet the goal of "smaller". On this basis, "faster, cheaper, and more reliable" cannot be ignored. [0003] All computing and communication systems of integrated circuits need to be powered by the power transmission subsystem. The power transmission subsystem converts the high voltage of the power supply into different voltages required by each discrete device in the integrated circuit and transmits them. In stacked package chips, the connection Each l...
Claims
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Inventor 黄晗林正忠吴政达陈彦亨赵梦波
Owner SJ SEMICON JIANGYIN CORP