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Digital-analog hybrid integrated optical transceiving SIP assembly

A digital-analog hybrid, optical transceiver technology, applied in electromagnetic transceivers, optical fiber transmission, etc., can solve problems such as single function, difficult software control, and reduced system reliability.

Pending Publication Date: 2021-04-23
CHINA AVIATION OPTICAL-ELECTRICAL TECH CO LTD
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  • Application Information

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Problems solved by technology

[0002] In existing optical communication systems, digital optical products and microwave optical products each use different packaging forms, interface interconnections, and processing units, which makes the integration of the entire system extremely low, resulting in large volume and weight of the product form; Restrictions: In the optical transmission process, the microwave optical transmission link and the digital optical transmission link are transmitted independently, which cannot give full play to their respective advantages and cannot adapt to the application requirements of the rapid development of optical transmission technology, resulting in single functions and limited applications ; Microwave optical and digital optical transmission systems realized by the existing technology, the hardware is difficult, the structure is complex, and the software control is not easy, which greatly reduces the reliability of the entire system

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Embodiment Construction

[0026] The present invention will be further described in detail below in conjunction with the accompanying drawings and preferred embodiments.

[0027] like Figure 1 to Figure 6 Shown is a specific embodiment of a digital-analog hybrid integrated optical transceiver SIP assembly of the present invention, the assembly adopts system package (SIP) technology to realize the integration of optoelectronic devices for digital communication and microwave optoelectronic devices, and the integrated electronic devices of the assembly include optoelectronic Different types of devices such as chips, electric drive chips, digital integrated chips, microwave radio frequency chips, and passive devices. The assembly includes four parts: substrate 1, digital-analog hybrid circuit, optical system, and tube shell 4. ) × 18mm (width) × 3mm (height); the lower part of the component is the substrate 1, the upper surface of the substrate 1 is provided with a digital-analog hybrid circuit, the four ...

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Abstract

The invention discloses a digital-analog hybrid integrated optical transceiving SIP assembly. The assembly comprises a substrate with pins at edges to send electric signals, a digital-analog hybrid circuit integrated on the substrate and used for photoelectric and electro-optical conversion, a tube shell fixed on the substrate and used for sealing the digital-analog hybrid circuit and an optical fibber. One end of the optical fiber is connected with the digital-analog hybrid circuit, and the other end of the optical fiber is connected with an AMT connector outside the tube shell so as to transmit optical signals. The digital-analog hybrid circuit comprises a detector chip, a radio frequency matching network, a low-noise amplifier, an equalizer, an attenuator and a filter. The digital-analog hybrid circuit further comprises a PIN photodiode, a transceiving integrated driving chip, a VCSEL chip and a single-chip microcomputer serving as a substrate core processor. The digital-analog hybrid integrated optical transceiving SIP assembly combines the advantages of ultrahigh frequency, large bandwidth, transparent transmission and the like of microwaves and the advantages of ultrahigh speed, low power consumption and high integration level of light, and has the characteristics of microwave and optical hybrid integrated transmission, ultra-miniaturization, high integration level, intelligence, high reliability and the like.

Description

technical field [0001] The invention relates to the technical field of digital-analog hybrid integration, in particular to a digital-analog hybrid integrated optical transceiver SIP component. Background technique [0002] In existing optical communication systems, digital optical products and microwave optical products each use different packaging forms, interface interconnections, and processing units, which makes the integration of the entire system extremely low, resulting in large volume and weight of the product form; Restrictions: In the optical transmission process, the microwave optical transmission link and the digital optical transmission link are transmitted independently, which cannot give full play to their respective advantages and cannot adapt to the application requirements of the rapid development of optical transmission technology, resulting in single functions and limited applications ; Microwave optical and digital optical transmission systems realized b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04B10/40H04B10/25
CPCH04B10/40
Inventor 左朋莎刘朋任欢宋春峰许利伟张江帆
Owner CHINA AVIATION OPTICAL-ELECTRICAL TECH CO LTD
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