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Full-automatic silicon wafer degumming equipment

A silicon wafer degumming, fully automatic technology, applied in chemical instruments and methods, cleaning methods and utensils, cleaning methods using liquids, etc., can solve problems such as poor compatibility, low work efficiency, slow speed, etc., to reduce the number of operators , Reduce labor cost, high cleanliness effect

Pending Publication Date: 2021-04-30
TIANJIN HUANBO SCI & TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The current degumming and cleaning of semiconductor round silicon wafers is mostly manual degumming, and automatic degumming is rare, and the equipment is imported, and the compatibility is relatively poor.
Semiconductor grade has high requirements on the quality of silicon wafers, so the speed of manual degumming is relatively slow and the work efficiency is low

Method used

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  • Full-automatic silicon wafer degumming equipment

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Embodiment Construction

[0037] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0038] figure 1 It shows a schematic structural diagram of an embodiment of the present invention, and specifically shows the structure of this embodiment. This embodiment relates to a fully automatic silicon wafer degumming and degumming equipment, which is used for degumming and cleaning single crystal silicon rods after cutting. The degumming and cleaning device can separate the silicon wafer from the material seat, and remove the residual glue on the silicon wafer at the same time; it has a turnover device, which can transfer the degummed silicon wafer to the slicing mechanism for slicing and inserting; it has degumming The handling device transports the cut silicon wafers when they are degummed, and realizes the automatic production of pre-cleaning, degumming and cleaning of the cut single crystal silicon rods, reduces labor intensity, inc...

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Abstract

The invention provides full-automatic silicon wafer degumming equipment. The equipment comprises a feeding mechanism used for feeding cut monocrystalline silicon rods; a cleaning and degumming device used for cleaning, degumming and gathering the cut monocrystalline silicon rods; a turnover device used for conveying degummed silicon wafers into a separation mechanism; and a degumming carrying device used for carrying the cut monocrystalline silicon rods during cleaning and degumming. The feeding mechanism, the cleaning and degumming device and the turnover device are sequentially arranged in the conveying direction of the cut monocrystalline silicon rods, and after the cut monocrystalline silicon rods are fed through the feeding mechanism and cleaned and degummed through the cleaning and degumming device, the degummed silicon wafers are carried to the separation mechanism through the turnover device to be separated; and the degumming carrying device corresponds to the cleaning and degumming device, so that the carrying of the cut monocrystalline silicon rods in the cleaning and degumming device is facilitated. The equipment has the beneficial effects that automatic pre-cleaning, degumming and cleaning of the silicon wafers are achieved, the productivity of the equipment is improved, and the labor cost is reduced.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to a fully automatic silicon chip degumming and degumming equipment. Background technique [0002] The current degumming and cleaning of semiconductor round silicon wafers is mostly manual degumming, and automatic degumming is rare, and the equipment is imported, and the compatibility is relatively poor. The semiconductor grade has high requirements on the quality of silicon wafers, so the speed of manual degumming is relatively slow and the work efficiency is low. Contents of the invention [0003] In view of the above problems, the problem to be solved by the present invention is to provide a fully automatic silicon wafer degumming and degumming equipment, which can automatically clean and degumming the cut monocrystalline silicon rods, which has a high degree of automation, reduces labor intensity, and improves work efficiency. [0004] In order to solve the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B3/02B08B3/10B08B3/08B08B13/00
CPCB08B3/02B08B3/024B08B3/08B08B3/10B08B13/00
Inventor 靳立辉姚长娟尹擎任志高杨骅杨国建王国瑞杨桂贺樊赛
Owner TIANJIN HUANBO SCI & TECH CO LTD
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