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Single-chip wet cleaning equipment

A wet cleaning, single-chip technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problem of low cleaning efficiency of single-chip cleaning equipment, inability to perform segmental cleaning with chemical cleaning solutions, and inability to effectively guarantee crystals. It can improve the cleaning efficiency and cleaning effect, improve the cleaning ability, and reduce the production cost.

Active Publication Date: 2021-04-30
ULTRON SEMICON (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the chemical cleaning liquid is usually sprayed by the spray head on the wet cleaning equipment to remove the contamination on the wafer surface, but all the current wet cleaning equipment There is only one cleaning chamber inside, so usually only the same cleaning liquid is used in the cleaning chamber of a wet cleaning equipment, and different types of chemical cleaning liquids cannot be cleaned in sections in the cleaning chamber of the same wet cleaning equipment. The cleaning efficiency of the chip cleaning equipment is very low
[0005] Moreover, the wet cleaning equipment is only equipped with traditional spray pipes that spray cleaning liquid from top to bottom. This traditional design can only clean the upper surface of the wafer. Cleaning, and during cleaning, under the action of centrifugal force, the cleaned particle pollutants tend to accumulate on the periphery of the wafer. Under the influence of the flow field at the bottom of the wafer, the particle pollutants accumulated on the periphery of the wafer will adhere to the surface of the wafer. The back of the round, the cleaning ability of this traditional wet cleaning equipment is very poor, and the quality of the wafer cannot be effectively guaranteed

Method used

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  • Single-chip wet cleaning equipment
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0109] Embodiment 1, the composite cavity structure of the single-piece wet cleaning equipment given in this embodiment includes a cavity shell 1, a support ring 2, a first isolation component and a second isolation component, and the first isolation component is installed There are jacking elements 8.

[0110] Wherein, the first isolation assembly includes a first-layer isolation ring 3 and a third-layer isolation ring 5 , and the second isolation assembly includes a second-layer isolation ring 4 and a fourth-layer isolation ring 6 .

[0111] The first layer of isolation ring 3 includes a first ring body 3-1, and a first isolation cover 3-2 extending from the inner wall of the first ring body 3-1 gradually slopes upward from the outside to the inside. A first ring edge 3-3 extends horizontally from the outer wall of the ring body 3-1, and a first locking groove 3-4 is opened at the bottom of the first ring edge 3-3.

[0112] The second layer isolation ring 4 includes a secon...

Embodiment 2

[0175] Embodiment 2. The structure of the single-chip wet cleaning equipment given in this embodiment is basically the same as that of Embodiment 1. The specific difference is that the first composite cavity structure of the single-chip wet cleaning equipment in this embodiment Conduit grooves 13 are also provided inside the second-layer isolation ring 4 , the third-layer isolation ring 5 and the fourth-layer isolation ring 6 .

[0176] The catheter groove on the second layer of isolation ring 4 communicates with the first layer of drainage cavity 9, the catheter groove on the third layer of isolation ring 5 communicates with the second layer of drainage cavity 10, and the fourth layer of isolation ring 6 The catheter groove communicates with the drainage cavity 11 of the third layer.

[0177] The conduit groove on the second-layer isolation ring 4 is arranged in its second ring body 4-1.

[0178] The conduit groove on the third layer of isolation ring 5 is arranged in its th...

Embodiment 3

[0190] Embodiment 3, the structure of the composite chamber used for wafer cleaning equipment given in this embodiment is basically the same as Embodiment 1 or Embodiment 2, the specific difference is that the first layer of isolation ring 3, the second The lower surfaces of the layer isolation ring 4 , the third layer isolation ring 5 and the fourth layer isolation ring 6 are respectively provided with splash guards 15 .

[0191] In this embodiment, other specific implementation manners are the same as those in Embodiment 1 or Embodiment 2, and details are not repeated here.

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Abstract

The invention discloses single-chip wet cleaning equipment which comprises an equipment shell, a composite cavity structure arranged in the equipment shell and a wafer supporting structure arranged in the composite cavity structure. At least one spraying pipe used for spraying cleaning liquid or gas to the surface of the wafer is installed on the equipment shell. The wafer supporting structure is used for suspending the wafer above the wafer supporting structure and spraying cleaning liquid to the back surface of the wafer; the composite cavity structure is internally provided with multiple layers of drainage cavities with adjustable cavity sizes, and the composite cavity structure is used for enabling cleaning liquid on the surface and the back surface of the wafer to flow to the outside of the equipment from the corresponding drainage cavities according to the type of the chemical cleaning liquid. The cleaning capacity is greatly improved, the cleaning efficiency and the cleaning effect are improved, and the wafer quality is effectively guaranteed.

Description

technical field [0001] The invention relates to the technical field of semiconductor process equipment, in particular to a single-chip wet cleaning equipment. Background technique [0002] Chemical cleaning is a method of using various chemical reagents or organic solvents to remove impurities attached to the surface of objects. In the field of semiconductor manufacturing, chemical cleaning refers to the process of removing various harmful impurities or oil stains adsorbed on the surface of semiconductors, metal materials and appliances. [0003] Wafer cleaning is a process of removing dirt by chemical cleaning of the entire batch or a single wafer by soaking or spraying chemicals. The main purpose is to remove pollutants on the wafer surface, such as dust particles ( particle), organic (organic), inorganic and metal ion (metal ion) and other impurities. [0004] At present, the chemical cleaning liquid is usually sprayed by the spray head on the wet cleaning equipment to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67051
Inventor 邓信甫吴海华毛明军刘大威
Owner ULTRON SEMICON (SHANGHAI) CO LTD