High-cleanness wet process equipment suitable for acid supply system

A kind of equipment and acid supply technology, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problem of low cleaning efficiency of single-chip cleaning equipment, inability to effectively guarantee the quality of wafers, and the inability of chemical cleaning fluid to be cleaned in sections, etc. question

Active Publication Date: 2021-04-30
ULTRON SEMICON (SHANGHAI) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the chemical cleaning liquid is usually sprayed by the spray head on the wafer cleaning equipment to remove the pollutants on the wafer surface, but at present, only one cleaning chamber is set in all wafer cleaning equipment, so the Usually only the same cleaning solution is used in the cleaning chamber, and different types of chemical cleaning solutions cannot be cleaned in sections in the cleaning chamber of the same wafer cleaning equipment, and the cleaning efficiency of single-wafer cleaning equipment is very low
[0005] Moreover, the wafer cleaning equipment is only equippe

Method used

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  • High-cleanness wet process equipment suitable for acid supply system
  • High-cleanness wet process equipment suitable for acid supply system
  • High-cleanness wet process equipment suitable for acid supply system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0148] Embodiment 1, the composite cavity structure of the single-chip wafer cleaning equipment given in this embodiment includes a cavity shell 1, a support ring 2, a first isolation component and a second isolation component, and the first isolation component is installed There are jacking elements 8.

[0149] Wherein, the first isolation assembly includes a first-layer isolation ring 3 and a third-layer isolation ring 5 , and the second isolation assembly includes a second-layer isolation ring 4 and a fourth-layer isolation ring 6 .

[0150] The first layer of isolation ring 3 includes a first ring body 3-1, and a first isolation cover 3-2 extending from the inner wall of the first ring body 3-1 gradually slopes upward from the outside to the inside. A first ring edge 3-3 extends horizontally from the outer wall of the ring body 3-1, and a first locking groove 3-4 is opened at the bottom of the first ring edge 3-3.

[0151] The second layer isolation ring 4 includes a seco...

Embodiment 2

[0219] Embodiment 2. The structure of the high-clean wafer wet cleaning device given in this embodiment is basically the same as that of Embodiment 1. The specific difference is that the second layer of the composite cavity structure of the wafer cleaning equipment in this embodiment Conduit grooves 13 are also provided inside the isolation ring 4 , the third layer isolation ring 5 and the fourth layer isolation ring 6 .

[0220] The catheter groove on the second layer of isolation ring 4 communicates with the first layer of drainage cavity 9, the catheter groove on the third layer of isolation ring 5 communicates with the second layer of drainage cavity 10, and the fourth layer of isolation ring 6 The catheter groove communicates with the drainage cavity 11 of the third layer.

[0221] The conduit groove on the second-layer isolation ring 4 is arranged in its second ring body 4-1.

[0222] The conduit groove on the third layer of isolation ring 5 is arranged in its third iso...

Embodiment 3

[0234] Embodiment 3, the structure of the composite chamber used for wafer cleaning equipment given in this embodiment is basically the same as Embodiment 1 or Embodiment 2, the specific difference is that the first layer of isolation ring 3, the second The lower surfaces of the layer isolation ring 4 , the third layer isolation ring 5 and the fourth layer isolation ring 6 are respectively provided with splash guards 15 .

[0235] In this embodiment, other specific implementation manners are the same as those in Embodiment 1 or Embodiment 2, and details are not repeated here.

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PUM

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Abstract

The invention discloses high-cleanness wet method equipment suitable for an acid supply system. The high-cleanness wet method equipment comprises a working cabin, an acid mixing device and wafer cleaning equipment, the interior of the working cabin is divided into a plurality of cabins through breathable partition plates, and the acid mixing devices and the wafer cleaning devices are alternately installed in the cabins of the working cabin. A fan filtering unit is mounted on the working cabin; the wafer cleaning equipment comprises an equipment shell, a composite cavity structure arranged in the equipment shell and a wafer supporting structure arranged in the composite cavity structure. An air extractor communicated with the composite cavity structure and used for extracting waste gas in the composite cavity structure and at least one spraying pipe used for spraying cleaning liquid or gas to the surface of the wafer are installed on the equipment shell. The cleaning capacity is greatly improved, the cleaning efficiency and the cleaning effect are improved, and the wafer quality is effectively guaranteed.

Description

technical field [0001] The invention relates to the technical field of semiconductor process equipment, in particular to a high-clean wet-process equipment suitable for an acid supply system. Background technique [0002] Chemical cleaning is a method of using various chemical reagents or organic solvents to remove impurities attached to the surface of objects. In the field of semiconductor manufacturing, chemical cleaning refers to the process of removing various harmful impurities or oil stains adsorbed on the surface of semiconductors, metal materials and appliances. [0003] Wafer cleaning is a process of removing dirt by chemical cleaning of the entire batch or a single wafer by soaking or spraying chemicals. The main purpose is to remove pollutants on the wafer surface, such as dust particles ( particle), organic (organic), inorganic and metal ion (metal ion) and other impurities. [0004] At present, the chemical cleaning liquid is usually sprayed by the spray head ...

Claims

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Application Information

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IPC IPC(8): H01L21/67
CPCH01L21/67051
Inventor 邓信甫刘大威陈丁堃吴海华
Owner ULTRON SEMICON (SHANGHAI) CO LTD
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