Roll-type manufacturing method of double-sided flexible circuit board and flexible circuit board manufactured by adopting same

Abstract

The invention discloses a roll-type manufacturing method of a double-sided flexible circuit board and the flexible circuit board manufactured by adopting the roll-type manufacturing method. The roll-type manufacturing method comprises the following steps of: step A, RTR double-sided pretreatment; step B, RTR double-sided PSPI coating and nitrogen pre-baking; step C, RTR double-sided PSPI exposure; step D, RTR double-sided PSPI development; and step E, RTR double-sided nitrogen baking. By adopting the roll-type manufacturing method, product manufacturing procedures can be greatly reduced, the product machining period is greatly shortened, correspondingly needed equipment, tools, materials and the like are greatly reduced, the production efficiency can be greatly improved, the human input is reduced, and the production cost is reduced.

Description

technical field [0001] The invention relates to the technical field of processing printed circuit boards, in particular to a roll-type manufacturing method of a double-sided flexible circuit board and the manufactured flexible circuit board. Background technique [0002] The insulation protection layer of the existing flexible circuit board is mainly made of cover film (CVL) after window opening and lamination. The processing cycle of the cover film is long and the thickness is ≥ 27.5um. ) has limited ability to open windows, such as CCM modules (CMOS Camera Module, camera module) flexible circuit boards and other flexible circuit board products with small pad window openings, which need to be made with photosensitive ink, and LCM modules ( LCD Module, that is, LCD display module) flexible circuit board products, also need to be made with thermosetting ink. Taking the process flow of the LCM module flexible circuit board as an example, in the processing steps, cover film (C...

AI Technical Summary

Problems solved by technology

[0003] For this reason, a few companies in the industry are actively developing alternative products—PSPI, Photo Sensitive PI, also known as photosensitive polyimide, which is a high-precision photosensitive and developing polyimide material. The sheet-to-chip production mode, referred to as SBS, takes the double-sided flexible circuit board of the LCM module as an example, such as figure 1 As shown, the current production process of using PSPI to replace the original insulating protective layer of the flexible circuit board is as follows: the chip substrate with the circuit has been manufactured, processed by the first front of SBS → the first side of SBS is coated with PSPI → the first side of SBS Nitrogen pre-baking→SBS first PSPI exposure→SBS first PSPI development→SBS first nitrogen post-curing→SBS second front processing→SBS second coating PSPI→SBS second nitrogen pre-baking→ PSPI exposure on the second side of SBS → PSPI development on the second side of SBS → nitrogen post-curing on the second side of SBS, that is, the PSPI insulating protective layer is made after 12 processes, and then the subsequent sandblasting, chemical nickel and gold and other product production processes are processed. The cycle is long, and it needs to go through multiple processes and corresponding equipment, tools and materials, etc., the production cost is high, and the piece-to-piece production mode is limited by equipment capabilities, especially affected by human factors, the product yield rate is not high, production The efficiency is low, and it also takes a lot of manpower. It can no longer meet the requirements of electronic products that are increasingly pursuing low cost, high timeliness, and ultra-thinness. At present, the PSPI manufacturing process and its equipment are all supporting chip-to-chip production, and there is no related PSPI volume pairing. Roll production process (referred to as RTR) and its equipment

Images