Automatic cutting device for thin film production

Abstract

The invention discloses an automatic cutting device for thin film production, which comprises a conveying frame and a cutting frame, a conveying mechanism is arranged in the conveying frame, a rack is arranged on one side of the upper end of the conveying frame, a cutting mechanism is arranged on one side of the rack through a transverse frame, the cutting frame is arranged on one side of the conveying frame, and the cutting mechanism is arranged on the other side of the conveying frame. A cutting-off plate is arranged on one side of the interior of the cutting-off frame, a cutting-off groove is formed in the cutting-off plate, and a winding mechanism is arranged on the other side of the interior of the cutting-off frame. By arranging the conveying mechanism, the end cutting mechanism and the winding mechanism, automatic conveying, cutting and winding of the thin film are achieved, the conveying, cutting and winding quality and efficiency of the thin film are improved, and then the production quality and efficiency of the thin film are improved.

Description

technical field [0001] The invention relates to the technical field of mechanical processing, in particular to an automatic cutting device for film production. Background technique [0002] A film is a thin, soft, transparent sheet. Made of plastic, adhesive, rubber or other materials. The scientific explanation of thin film is: a 2-dimensional material formed by depositing atoms, molecules or ions on the surface of a substrate. Example: optical film, composite film, superconducting film, polyester film, nylon film, plastic film, etc. Films are widely used in electronics, machinery, printing and other industries. Thin film materials refer to thin metal or organic layers with a thickness ranging from a single atom to a few millimeters. Electronic semiconductor functional devices and optical coatings are the main applications of thin film technology. Interference caused by thin films. Membranes can be transparent solids, liquids, or thin layers of gas sandwiched between ...

AI Technical Summary

Problems solved by technology

[0004] The existing film cutting device often has the following disadvantages: when the film is transported to the cutting device, the film will wrinkle during the transport process, and the transport efficiency is poor. When the film is cut, the film will be cut unevenly and the cutting quality will be poor. And the efficiency is low. After the film is cut, when the film is rewound by the rewinding device, the rewinding drum must be replaced repeatedly, which is difficult to operate and takes time and effort. Therefore, we urgently need an automatic cutting device for film production.

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