Sorting equipment for chip production

A device and chip technology, which is applied in the field of sorting equipment for chip production, can solve the problems of reducing the reliability of chip sorting equipment, reducing the stability of suction cup adsorption chips, and easy aging of suction nozzles.

Inactive Publication Date: 2021-05-11
南京群博新能源技术开发有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When the existing chip sorting equipment moves the chips, the chips are prone to greater wind resistance, which easily increases the probability that the suction pipe on the suction cup will be separated from the air intake pipe, thereby reducing the stability of the suction cup for absorbing chips, and easily causing damage to the chips. The reliability of the existing chip sorting equipment

Method used

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  • Sorting equipment for chip production
  • Sorting equipment for chip production
  • Sorting equipment for chip production

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Embodiment Construction

[0029] The present invention is described in further detail now in conjunction with accompanying drawing. These drawings are all simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, so they only show the configurations related to the present invention.

[0030] Such as figure 1As shown, a sorting device for chip production includes a base 1, a top plate 3, a moving device 4, a suction pump 5, an air inlet pipe 7, an air outlet pipe 6, a suction pipe 9, a suction cup 8, a disassembly mechanism, two A clamping mechanism and two support columns 2, the two support columns 2 are vertically fixed on both sides above the base 1 respectively, the two sides of the top plate 3 are respectively connected with the orders of the two support columns 2, and the moving The device 4 is arranged under the top plate 3, the moving device 4 is connected with the suction pump 5, the suction pump 5 is communicated with the air outl...

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Abstract

The invention relates to sorting equipment for chip production, which comprises a base, a top plate, a moving device, a suction pump, an air inlet pipe, an air outlet pipe, a suction pipe, a suction cup, a dismounting and mounting mechanism, two clamping mechanisms and two supporting columns; the dismounting and mounting mechanism comprises a fixed ring, two positioning rods and two dismounting and mounting assemblies; each of the dismounting and mounting assemblies comprises a pulling plate, a fixed rod, two limiting blocks, two pieces of elastic cloth and a plurality of elastic ropes; and each of the clamping mechanisms comprises a power assembly, a branch pipe and a plurality of clamping assemblies. According to the sorting equipment for the chip production provided by the invention, through the dismounting and mounting mechanism, the convenience of dismounting and mounting the suction cup is improved, the workload of a user is reduced, and the practicability of the equipment is improved; by means of the clamping mechanisms, the function of fixing and clamping the positioning rods is achieved, the probability that the suction pipe is separated from the air inlet pipe when a chip is moved is reduced, therefore, the suction pipe is not prone to being separated from the air inlet pipe, and the stability of adsorbing the chip is improved.

Description

technical field [0001] The invention relates to the field of chip production, in particular to a sorting device for chip production. Background technique [0002] The conductor chip is to cut wafers of different sizes into predetermined sizes. In order not to mess up the cut semiconductor chips during cutting, the wafer is bonded with an adhesive holding tape on the back side, and the wafer is cut from the front side by a wafer cutting device. , although the holding tape bonded on the back is cut into several pieces, it is not cut off and becomes the state of holding each semiconductor chip. The chip is removed from the holding tape and placed in the chip carrier for subsequent assembly. This process is called chip sorting , Sorting will install the electrical performance to divide the chips into qualified products and unqualified products or into different grades. [0003] When the existing chip sorting equipment moves the chips, the chips are prone to greater wind resista...

Claims

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Application Information

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IPC IPC(8): B07C5/36H01L21/67
CPCB07C5/362H01L21/67271
Inventor 刘金生
Owner 南京群博新能源技术开发有限公司
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