Filling material formed by recycling non-metal powder of waste circuit boards and preparation method of filling material
A technology for waste circuit boards and fillers, which is applied to the field of fillers formed by recycling waste circuit board non-metallic powders and its preparation, and can solve the problems of diversity and low cost of recycling non-metallic powders of waste electronic circuit boards that have not been proposed. problem, to achieve the effect of reducing product cost, simple preparation process and convenient operation
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Embodiment 1
[0035] A filler for recycling waste circuit board non-metal powder, which consists of the following components by weight: 30% solid plastic, 60% 20-mesh waste circuit board non-metal powder, 10% processing aids, of which solid The plastic is PE, the diameter is less than 5mm, and the processing aids are 2% lubricant, 3% stabilizer, 3% compatibilizer, and 2% toner.
Embodiment 2
[0037] A filler for recycling waste circuit board non-metal powder, which consists of the following components by weight: 64% solid plastic, 27.7% 20-mesh waste circuit board non-metal powder, 8.3% processing aids, of which solid The plastic is waste PVC, and the processing aids are 2% lubricant, 2% stabilizer, 2% compatibilizer, 2% toner, and 0.3% titanate coupling agent.
Embodiment 3
[0039] A filler for recycling waste circuit board non-metal powder, which consists of the following components by weight: 45% solid plastic, 46% 20-mesh waste circuit board non-metal powder, 9% processing aids, of which solid The plastic is waste PA, and the processing aids are 2% lubricant, 2% stabilizer, 2% compatibilizer, 2% toner, and 1% titanate coupling agent.
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