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Thermally conductive composition and methods and devices in which said composition is used

A composition and technology of thermally conductive fillers, applied in the direction of heat exchange materials, chemical instruments and methods, semiconductor devices, etc., can solve problems such as not reaching the level of thermal conductivity

Active Publication Date: 2021-05-14
DOW GLOBAL TECH LLC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, to date, existing technologies have not achieved the levels of thermal conductivity that are now required in the industry

Method used

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  • Thermally conductive composition and methods and devices in which said composition is used
  • Thermally conductive composition and methods and devices in which said composition is used
  • Thermally conductive composition and methods and devices in which said composition is used

Examples

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example

[0090] These examples are intended to illustrate the invention to those skilled in the art and should not be construed as limiting the scope of the invention as set forth in the claims. Samples of thermally conductive silicone compositions were prepared using the following ingredients. The components used are listed in Table 1 below. Component (A) is exemplified by (a-1). Component (A'1) is exemplified by (a'1-1). Component (A'2) is exemplified by (a'2-1) and (a'2-2). Component (B) is exemplified by (b-1), (b-2) and (b-3). Component (C) is exemplified by (c-1). Component (D-1) is exemplified by (d1-1) and (d1-2). Component (D-2) is exemplified by (d2-1) and (d2-2). Component (D-3) is exemplified by (d3-1) and (d3-2). Component (E) is exemplified by (e-1). Component (F) is exemplified by (f-1).

[0091] Table 1

[0092]

[0093]

[0094] The particle size of (d1-1) was determined by Beckman Coulter counter and also by electron micrograph. Use 8-11 ASTM D4315 me...

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Abstract

A highly thermally conductive composition is provided, such composition comprising: (A) An organopolysiloxane composition; (B) a filler treating agent; (C) a thermal stabilizer; and (D) thermally conductive filler mixture, comprising: (D-1) a small-particulate thermally conductive filler having a mean size of up to 3 [mu]m, (D-2) spherical aluminum nitride having a mean size of from 50 to 150 [mu]m, (D-3) boron nitride having a mean size of from 20 to 200 [mu]m.

Description

technical field [0001] The invention discloses a silicone composition with high thermal conductivity, its preparation and use method and a device containing it. The silicone compositions are useful as part of thermal interface materials and heat dissipation materials in electronic devices. Background technique [0002] With the generational shift of the telecom industry to 5G networks, highly integrated electronic devices with smaller size will bring double power consumption (power unit from 600W to 1200W), and higher heat generation if no one is present performance will be impaired. Therefore, a more efficient thermal management system is urgently needed. [0003] Various thermally conductive materials are known. WO2016190189A describes a composition containing spherical thermally conductive fillers comprising aluminum (Al) or boron nitride (BN), but not both. US6255257B1 describes a composition containing aluminum nitride (AlN) powers of two different size distribution...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/04C08K3/38C08K3/28C08K7/00H01L23/36H05K7/20
CPCC08G77/12C08G77/20C08G77/80C08G77/18H01L23/42H01L23/3737C08K9/06C08K2003/385C08K2003/282C08K2201/005C08K2003/2296C08K2003/2227C08K2201/001C08K2003/382C08L83/04C08K5/56C08L83/00C08K13/04C08K3/38C08K3/10C08K3/22C08K3/28C08K5/3417C08K7/18C08K2201/014C09K5/14F28F23/00
Inventor 胡小链张纪光郑艳陈红宇陈晨D·巴格瓦格D·汉森
Owner DOW GLOBAL TECH LLC