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Semiconductor punching auxiliary device facilitating residue removal during punching

An auxiliary device and residue technology, which is applied to fine working devices, working accessories, stone processing equipment, etc., can solve the problems of poor cleaning effect, low work efficiency, time-consuming and laborious, etc., and achieve better results, accurate cleaning, The effect of improving work efficiency

Inactive Publication Date: 2021-05-28
南京玮君杰商贸有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides an auxiliary device for semiconductor drilling that facilitates the cleaning of residues during drilling. , low work efficiency, high energy consumption, poor cleaning effect

Method used

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  • Semiconductor punching auxiliary device facilitating residue removal during punching
  • Semiconductor punching auxiliary device facilitating residue removal during punching
  • Semiconductor punching auxiliary device facilitating residue removal during punching

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Embodiment Construction

[0023] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0024] see Figure 1-5 , a semiconductor punching auxiliary device which is convenient for cleaning residues when punching holes, comprising a casing 1, a storage table 2 is fixedly installed inside the casing 1, the bottom left side of the casing 1 is the storage table 2, and the right side is provided with There is a screen, with holes on both sides, and the left side table 2 is higher than the height of the screen, the inside of th...

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Abstract

The invention relates to the technical field of semiconductor machining equipment, and discloses a semiconductor punching auxiliary device facilitating residue removal during punching, the semiconductor punching auxiliary device comprises a shell, an object containing table is fixedly installed in the shell, a conveying device is fixedly installed in the object containing table, and a driving wheel is connected in the shell in a rotating mode. The front face of the driving wheel is connected with a driving rod in a rotating mode. According to the semiconductor punching auxiliary device facilitating residue removal during punching, the driving wheel drives an air blowing pipe and a rotating head to intermittently move up and down in a reciprocating mode, continuous and intermittent punching and air blowing are achieved, it is guaranteed that a draught fan does not work during punching, the draught fan removes residues in holes when punching is not conducted, and workers do not need to conduct cleaning. More time and labor are saved, the working efficiency of punching is greatly improved, energy consumption is reduced due to intermittent work of the draught fan, the semiconductor punching auxiliary device saves more labor and is more environment-friendly, the holes can be accurately cleaned, and the cleaning effect is better.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing equipment, in particular to a semiconductor punching auxiliary device which is convenient for cleaning residues during punching. Background technique [0002] A semiconductor is a material whose conductivity can be controlled, ranging from insulators to conductors. Whether from the perspective of technology or economic development, the importance of semiconductors is very huge. With the integration and miniaturization of electronic devices, the requirements for the miniaturization of semiconductors are increasing day by day. As one of the basic components of unit elements, micropores are required to be small in diameter and large in aspect ratio for many core components. [0003] In the prior art, when drilling semiconductor holes, due to the small hole diameter, it is difficult to remove the internal residues, which requires manual cleaning, which is time-consuming and labor-int...

Claims

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Application Information

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IPC IPC(8): B28D5/02B28D5/00B28D7/02
CPCB28D5/0076B28D5/021B28D7/02
Inventor 曾军玮
Owner 南京玮君杰商贸有限公司
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