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S1.0 micro inner hole machining process

A processing technology and inner hole technology, which is applied in the field of S1.0 micro inner hole processing technology, can solve the problems of high roughness of the inner wall of the small hole, high cost of small hole processing, increased production cost, etc., and reduce the probability of drill bit chipping , reduce processing costs, and eliminate the effects of chip waste

Pending Publication Date: 2021-06-18
昆山利东精密工业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The small-diameter drill directly processes the tiny hole of S1.0 on the workpiece. Due to chip removal, the inner wall of the small hole will have a higher roughness. It is necessary to purchase a higher-priced drill to ensure the machining accuracy, resulting in the processing cost of the small hole. Expensive, increasing the production cost of the enterprise

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] A S1.0 tiny inner hole machining process, comprising the following steps:

[0016] S1, place the workpiece in the customized first fixture. After the first fixture is fixed in the spark machine, the workpiece is immersed in the liquid surface of the electrolyte, and the center of the machining circle of the hole is facing the electrode of the spark machine, and the electrode rotates at a certain speed. , process a 0.6mm spark hole on the workpiece;

[0017] S2, after the EDM is completed, take out the fixture carrying the workpiece, turn the workpiece upside down so that the spark holes formed by EDM face down, use a high-pressure air source to blow the small holes, and discharge the processing waste;

[0018] S3, using a special go-no-go gauge to detect the aperture of the spark hole;

[0019] S4, transferring the detected workpiece to the customized second fixture, and clamping the second fixture into the drilling machine;

[0020] S5, the CCD camera installed on th...

Embodiment 2

[0024] A S1.0 tiny inner hole machining process, comprising the following steps:

[0025] S1, place the workpiece in the customized first fixture. After the first fixture is fixed in the spark machine, the workpiece is immersed in the liquid surface of the electrolyte, and the center of the machining circle of the hole is facing the electrode of the spark machine, and the electrode rotates at a certain speed. , process a 0.7mm spark hole on the workpiece;

[0026] S2, after the EDM is completed, take out the fixture carrying the workpiece, turn the workpiece upside down so that the spark holes formed by EDM face down, use a high-pressure air source to blow the small holes, and discharge the processing waste;

[0027] S3, using a special go-no-go gauge to detect the aperture of the spark hole;

[0028] S4, transferring the detected workpiece to the customized second fixture, and clamping the second fixture into the drilling machine;

[0029] S5, the CCD camera installed on th...

Embodiment 3

[0032] A S1.0 tiny inner hole machining process, comprising the following steps:

[0033] S1, place the workpiece in the customized first fixture. After the first fixture is fixed in the spark machine, the workpiece is immersed in the liquid surface of the electrolyte, and the center of the machining circle of the hole is facing the electrode of the spark machine, and the electrode rotates at a certain speed. , process a 0.8mm spark hole on the workpiece;

[0034] S2, after the EDM is completed, take out the fixture carrying the workpiece, turn the workpiece upside down so that the spark holes formed by EDM face down, use a high-pressure air source to blow the small holes, and discharge the processing waste;

[0035] S3, using a special go-no-go gauge to detect the aperture of the spark hole;

[0036] S4, transferring the detected workpiece to the customized second fixture, and clamping the second fixture into the drilling machine;

[0037] S5, the CCD camera installed on th...

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PUM

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Abstract

The invention provides an S1.0 micro inner hole machining process, comprising the following steps that: a workpiece is placed in a customized first clamp, after the first clamp is fixed in a spark machine, the workpiece is immersed below the liquid level of electrolyte, the machining circle center of a hole right faces an electrode of the spark machine, the electrode rotates at a certain speed, and a spark hole of 0.6-0.8 mm is machined in the workpiece; a CCD camera installed on a drilling machine shoots the spark hole of the workpiece and calculates the center position of the spark hole, and a drill bit walks to the position over the spark hole according to data fed back by a CCD visual system; and the drill bit moves downwards to machine the spark hole at a speed of 500-1000 r / min. Before drilling, the spark machine is adopted to machine a bottom hole with a small diameter, a part of materials are eliminated, in this way, in the drilling machining process, the influence of cuttings and sweeps can be eliminated, the probability of tipping of the drill bit can be reduced, an expensive drill bit does not need to be customized, and the machining cost is reduced.

Description

technical field [0001] The invention relates to the technical field of electronic product finishing, in particular to an S1.0 micro inner hole processing technology. Background technique [0002] S1.0 Micro hole refers to a small hole with a diameter not greater than 1.0mm. The processing requirements for small holes of precision parts are: processing accuracy ≤ ± 0.003mm, roundness of processed holes < 0.003mm. The small-diameter drill directly processes the tiny hole of S1.0 on the workpiece. Due to chip removal, the inner wall of the small hole will have a higher roughness. It is necessary to purchase a higher-priced drill to ensure the machining accuracy, resulting in the processing cost of the small hole. Expensive, increasing the production cost of the enterprise. Contents of the invention [0003] The technical problem to be solved by the invention is: how to reduce the processing cost of the S1.0 tiny hole. [0004] In order to solve the problems of the techno...

Claims

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Application Information

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IPC IPC(8): B23P15/00B23H9/14B23H11/00B23Q11/00
CPCB23P15/00B23H9/14B23H11/00B23Q11/0042
Inventor 张小星刘强陈蓉杨政颖杨孟钧
Owner 昆山利东精密工业有限公司