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Method for drying cleaned semiconductor wafer

A semi-conductor and post-cleaning technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of airflow velocity limitation, influence on drying efficiency, airflow disorder, etc., to increase quantity, improve drying efficiency, and improve The effect of production efficiency

Active Publication Date: 2021-06-18
JIANGSU ASIA ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this device has the following disadvantages: 1. The hot air in the drying box is constantly stirred by the rotation of the wafer, which makes the air flow turbulent, but the wafer still needs to move smoothly, so the flow speed of the air flow is limited, which affects the drying efficiency; 2. The wafer needs to be placed on the support plate, so the lower surface of the wafer is in contact with the support plate, and the lower surface of the wafer cannot be dried, and the wafer needs to be turned over to completely dry the wafer

Method used

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  • Method for drying cleaned semiconductor wafer
  • Method for drying cleaned semiconductor wafer
  • Method for drying cleaned semiconductor wafer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] like Figure 1-7 As shown, the drying device for semiconductor wafer cleaning includes a drying box 1, and the drying box 1 is mainly composed of a supporting leg 101, a bottom plate 102, a casing 103, a top plate 104, a dust cover 105, and a sealed door 106. The top of the leg 101 is connected to the bottom plate 102 by bolts, the outer top of the bottom plate 102 is connected to the shell 103 by bolts, the top of the shell 103 is connected to the top plate 104 by bolts, the top of the top plate 104 is provided with a vent hole, and the inside of the vent hole is screwed with a dustproof The cover 105, the front end of the shell 103 is connected with a sealed door 106 through a hinge, and also includes a drying mechanism 2 and a discharge mechanism 4. The inside of the shell 103 is provided with a drying mechanism 2 at the center, and the outside of the drying mechanism 2 is provided with a discharge mechanism 4. The discharge mechanism 4 includes an upper planetary fr...

Embodiment 2

[0049] like Figure 8 As shown, the difference between Embodiment 2 and Embodiment 1 is that the transmission assembly 303 includes a main sprocket 31, a driven sprocket 32, and a transmission chain 33. The main sprocket 31 is connected to the outside of the drive shaft 302 by a key, and the driven chain The wheel 32 is connected to the outside of the rotating rod 4021 by a key, and the drive chain 33 is transmitted between the main sprocket 31 and all driven sprockets 32, so that the main sprocket 31 can be driven by the driven sprocket 32 ​​to drive the drive chain 33 to rotate. Transmission chain 33 drives rotation bar 4021 to rotate, has realized the rotation function of rotation bar 4021, and transmission chain 33 inner side is meshed with driven sprocket 32 ​​and is connected, and transmission chain 33 outside is meshed with main sprocket 31 and is connected, is arranged like this and has realized through driven sprocket. The sprocket 32 ​​makes the specific transmission...

Embodiment 3

[0054] The drying method after semiconductor wafer cleaning, using the drying device for semiconductor wafer cleaning of embodiment 1 or 2, comprises the following steps:

[0055] S1: open the airtight door 106;

[0056] S2: Put the cleaned wafer inside the discharge ring 40223, and rotate the lower planet carrier 403 and the rotating rod 4021 during this process, so that the discharge ring 40223 is close to the airtight door 106, so that the wafer is fully loaded Material ring 40223;

[0057] S3: Close the airtight door 106 and turn on the motor 301, the fan 201 and the heating wire 205 to be energized, the heating wire 205 is energized to generate heat, the fan 201 is started to generate airflow, the airflow is heated by the heating wire 205 to become a hot airflow, and the hot airflow passes through the central tube 202 , the connecting pipe 203 and the air outlet pipe 204 are blown to the upper center and the lower center of the wafer; at this time, the water on the wafer...

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Abstract

The invention discloses a method for drying a cleaned semiconductor wafer. The method comprises the following steps that a fan is started to generate an airflow, the airflow is heated by a heating wire to form a hot airflow, and the hot airflow is blown to the upper center and the lower center of the wafer through a central pipe, a connection pipe and an air outlet pipe; and the motor is started to drive a driving shaft to rotate, the driving shaft drives a driving gear to rotate, the driving gear drives a transmission gear to rotate, the transmission gear drives a driven gear to rotate, then all the rotating rods are driven to rotate, the rotating rods drive the discharging frame to rotate, and then wafers on the discharging frame are alternately aligned with the hot airflow. Wafer drying is achieved, the plurality of wafers can be dried, and the drying efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of wafer drying, in particular to a method for drying semiconductor wafers after cleaning. Background technique [0002] In the manufacturing process of semiconductors, pattern transfer processes are required, including photolithography processes. The photolithography process is a pattern duplication technology, which is a key technology in the semiconductor manufacturing process. In simple terms, lithography is inspired by photographic technology, and uses the photosensitive properties of photoresist to accurately copy the pattern of the photolithography mask onto the photoresist coated on the wafer. Before the photoresist is spin-coated onto the wafer, the wafer surface needs to be baked because the wafer surface is cleaned. [0003] The Chinese patent with the publication number CN109663723A discloses a drying device for wafers, which includes a drying box. A humidity sensor, a driving mechanism and a p...

Claims

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Application Information

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IPC IPC(8): H01L21/02H01L21/67
CPCH01L21/02002H01L21/0201H01L21/67034H01L21/67109
Inventor 钱诚李刚周志勇田晓东
Owner JIANGSU ASIA ELECTRONICS TECH CO LTD
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