Laser processing method
A laser processing method and laser processing technology, applied in metal processing, laser welding equipment, metal processing equipment and other directions, can solve problems such as poor segmentation and quality degradation
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Embodiment approach 1
[0034] The laser processing method according to Embodiment 1 of the present invention will be described with reference to the drawings. First, the workpiece 1 to be processed in the laser processing method according to the first embodiment will be described. figure 1 It is a perspective view showing the workpiece to be processed in the laser processing method according to the first embodiment. figure 2 is along figure 1 The sectional view of the line II-II.
[0035] (processed object)
[0036] Such as figure 1 and figure 2 As shown, both the one surface 2 of the workpiece 1 and the other surface 3 on the back side of the one surface 2 of the workpiece 1 to be processed in the laser processing method according to Embodiment 1 are curved surfaces having curvature. That is, both surfaces 2 and 3 are surfaces having curvature. In Embodiment 1, the workpiece 1 is made of a light-transmitting material, and is a convex lens whose two surfaces 2 and 3 are convex curved surface...
Embodiment approach 2
[0067] A laser processing method according to Embodiment 2 of the present invention will be described with reference to the drawings. Figure 17 It is a flowchart showing the flow of the laser processing method of Embodiment 2. In addition, in Figure 17 In FIG. 1 , the same reference numerals are assigned to the same parts as those in Embodiment 1, and description thereof will be omitted.
[0068] The laser processing method of Embodiment 2 is the same as that of Embodiment 1 except that the peeling step ST5 is performed before the division step ST4. In the peeling step ST5 of the laser processing method according to the second embodiment, the covering member 30 covered on the one surface 2 of the workpiece 1 is peeled from the workpiece 1 in the same manner as in the first embodiment before the dividing step ST4 .
[0069] In the laser processing method of Embodiment 2, in the coating step ST2, one surface 2 having curvature of the workpiece 1 is covered with the coating m...
Embodiment approach 3
[0071] A laser processing method according to Embodiment 3 of the present invention will be described with reference to the drawings. Figure 18 It is a perspective view showing a workpiece to be processed in the laser processing method according to the third embodiment. Figure 19 yes Figure 18 A cross-sectional view of the main part of the workpiece shown.
[0072] The laser processing method of Embodiment 3 is the same as Embodiment 1 and Embodiment 2 except that the workpiece 1-3 to be processed is different.
[0073] The workpiece 1-3 to be processed in the laser processing method according to the third embodiment is a disc-shaped semiconductor wafer, an optical device wafer, or the like wafer with silicon, sapphire, SiC (silicon carbide), or gallium arsenide as the substrate 70 . Such as Figure 18 As shown, in the workpiece 1 - 3 , devices 73 are formed in each region demarcated by a plurality of planned processing lines 72 formed in a grid pattern on the front surf...
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Abstract
Description
Claims
Application Information
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