Unlock instant, AI-driven research and patent intelligence for your innovation.

High-heat-dissipation conductive adhesive and preparation method thereof

A conductive adhesive, high heat dissipation technology, used in conductive adhesives, adhesives, epoxy resin adhesives, etc., can solve the problem of large addition amount, and achieve the effect of less added materials, improved performance, and improved heat dissipation capacity

Pending Publication Date: 2021-06-22
SHANGHAI PLASTICS RES INST CO LTD
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this patent, silver powder is used as a necessary raw material, and the amount added is large

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High-heat-dissipation conductive adhesive and preparation method thereof
  • High-heat-dissipation conductive adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] 1. Weigh a certain amount of bisphenol F-type epoxy resin in a container, add 40% of the total amount of conductive adhesive, flake silver powder 0295 with a particle size of 5um, and 25% of petal-shaped silver powder with a size of 5um. After preliminary manual stirring with a stirring rod, place it in a rotation and revolution rotator at a speed of 500 rpm for vacuum defoaming and rotation for 5 minutes to obtain a finished conductive adhesive.

[0029] 2. Use a laminar viscometer to test the viscosity of the prepared conductive adhesive and calculate the thixotropic index. The thixotropic index of the above-mentioned conductive adhesive is 3.01. The above-mentioned conductive adhesive was placed in a -40°C environment for two weeks, and no sedimentation occurred. Cured at 175°C for 1 hour to obtain a cured part, the strength at room temperature was measured to be 12.5MPa, and the volume resistivity was 6.5*10 -5 , The thermal conductivity is 4.1W / (m·k).

Embodiment 2

[0031] 1. Weigh a certain amount of bisphenol F epoxy resin into a container, add 35% flake silver powder 0295 with a particle size of 5um, and 35% petal silver powder with a size of 5um. After preliminary manual stirring with a stirring rod, place it in a rotation and revolution rotator at a speed of 500 rpm for vacuum defoaming and rotation for 5 minutes to obtain a finished conductive adhesive.

[0032] 2. Use a laminar viscometer to test the viscosity of the prepared conductive adhesive and calculate the thixotropic index. The thixotropic index of the above-mentioned conductive adhesive is 3.5. The above-mentioned conductive adhesive was placed in a -40°C environment for two weeks, and no sedimentation occurred. Cured at 175°C for 1 hour to obtain a cured part. The strength at room temperature was measured to be 11.5MPa, and the volume resistivity was 2.45*10. -5 , The thermal conductivity is 3.8W / (m·k).

Embodiment 3

[0034] 1. Weigh a certain amount of bisphenol F-type epoxy resin into a container, add 50% flake silver powder 0295 with a particle size of 5um, and 25% petal-shaped silver powder with a size of 5um. After preliminary manual stirring with a stirring rod, place it in a rotation and revolution rotator at a speed of 500 rpm for vacuum defoaming and rotation for 5 minutes to obtain a finished conductive adhesive.

[0035] 2. Use a laminar viscometer to test the viscosity of the prepared conductive adhesive and calculate the thixotropic index. The thixotropic index of the above-mentioned conductive adhesive is 4.1. The above-mentioned conductive adhesive was placed in a -40°C environment for two weeks, and no sedimentation occurred. Cured at 175°C for 1 hour to obtain a cured part. The room temperature strength was 8.0MPa, the high temperature strength was 2.2MPa, and the volume resistivity was 1.83*10. -5 , The thermal conductivity is 9.24W / (m·k).

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Particle sizeaaaaaaaaaa
Sizeaaaaaaaaaa
Room temperature strengthaaaaaaaaaa
Login to View More

Abstract

The invention belongs to the technical field of conductive material preparation, and particularly relates to a high-heat-dissipation conductive adhesive and a preparation method thereof. The high-heat-dissipation conductive adhesive is prepared from, by mass, 20-80% of epoxy resin, 20-80% of flaky silver powder, 5-60% of novel silver powder, and the balance of epoxy resin, the sum of the mass percentage content of the epoxy resin, the flaky silver powder and the novel silver powder is 100%, and the novel silver powder is one or more of micron-sized superfine silver powder in a pine ball shape, a petal shape, a dendritic shape, a rod shape or a flocculent shape. Compared with the prior art, the preparation method is extremely simple, the prepared conductive adhesive contains a small amount of the novel silver powder, the cost is not too high, and the performance of the conductive adhesive can be greatly improved. Few materials are added, the construction manufacturability is good, and the stability is high. The thixotropic index of the prepared conductive adhesive meets the standard of adhesive dispensing in the general semiconductor packaging process, and the conductive adhesive is good in heat dissipation performance and suitable for fine semiconductor packaging with high requirements for heat dissipation.

Description

technical field [0001] The invention belongs to the technical field of conductive material preparation, and in particular relates to a high heat dissipation conductive adhesive and a preparation method thereof. Background technique [0002] Conductive glue replaces welding to connect conductive elements, which overcomes the shortcomings of welding methods such as weak joints, deformation of parts, and reduced performance. With the miniaturization and weight reduction of electrical and electronic equipment, conductive adhesives have become an indispensable material in the electronics industry. Conductive adhesives are widely used in electrical components and components such as large-scale integrated circuits, detectors, body sensors, photosensitive elements, cameras, and instrument waveguides. In recent years, as the packaging of electronic components, electronic components can be packaged by coating conductive glue on the electronic circuit, and then placing the electronic ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C09J163/00C09J9/02
CPCC09J163/00C09J9/02C08K2003/0806C08K2201/014C08K2201/003
Inventor 张凌云左兴吴存雷薛英俊
Owner SHANGHAI PLASTICS RES INST CO LTD