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Optical module

A technology of optical modules and light sources, applied in the field of optical modules, can solve the problem of increased heat dissipation burden of silicon optical chips, and achieve the effect of reducing thickness

Active Publication Date: 2021-06-22
HISENSE BROADBAND MULTIMEDIA TECH
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  • Abstract
  • Description
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Problems solved by technology

[0004] The embodiment of the present application provides an optical module to solve the problem of aggravating the heat dissipation burden of the silicon photonic chip caused by attaching the light source to the silicon photonic chip

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Embodiment Construction

[0043] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0044] One of the core links of optical fiber communication is the mutual conversion of optical and electrical signals. Optical fiber communication uses optical signals carrying information to be transmitted in information transmission equipment such as optical fibers / optical waveguides, and the passive transmission characteristics of light in optical fibers / optical waveguides can be used to achieve low-cost, low-loss information transmission; and information proces...

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Abstract

The invention provides an optical module which is characterized in that a light source is arranged in a groove formed in a circuit board and is electrically connected with the circuit board through a bonding wire or a flexible circuit board; one end of a first optical fiber ribbon is connected with the light source, and the other end is optically connected with the optical port of a silicon optical chip; and the silicon optical chip is arranged on the circuit board, is electrically connected with the adapter plate, and is used for performing signal modulation on the light output by the light source. The light source is arranged on the surface of the circuit board, and the light source is in optical connection with the silicon optical chip through the optical fiber ribbon, so that heat generated in the working process of the light source can be diffused through the circuit board, and the situation that the heat generated by the light source is directly conducted to the silicon optical chip due to direct contact between the light source and the silicon optical chip is effectively avoided; and the heat dissipation burden of the silicon optical chip is increased. In addition, the light source is directly arranged on the surface of the circuit board, so that the thickness of the optical module is reduced.

Description

technical field [0001] The present application relates to the technical field of optical fiber communication, and in particular to an optical module. Background technique [0002] In cloud computing, mobile Internet, video and other new business and application modes, optical communication technology will be used, and optical modules are key components in optical communication equipment. Among them, the use of silicon photonic chips to realize the photoelectric conversion function has become a mainstream solution adopted by high-speed optical modules. [0003] In a silicon photonic module, a silicon photonic chip is usually attached to the surface of a circuit board; then, a light source is attached to the upper surface of the silicon photonic chip to provide the silicon photonic chip with light that does not carry data. Since a large amount of heat is generated during the working process of the light source, the heat generated by the light source needs to be diffused throu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/42
CPCG02B6/4266G02B6/428G02B6/4245
Inventor 郑龙杨思更
Owner HISENSE BROADBAND MULTIMEDIA TECH
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