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Laser lead correction device and use method

A technology for lasers and leads, which is applied in the field of laser lead correction devices, can solve problems such as the inapplicability of laser lead correction, and achieve the effects of simple structure, convenient use, and improved production efficiency

Active Publication Date: 2021-06-22
潍坊华光光电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This correction structure provides a flat surface for the subsequent covering layer and is suitable for various directional surface warpages, but it is not suitable for laser lead correction

Method used

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  • Laser lead correction device and use method
  • Laser lead correction device and use method
  • Laser lead correction device and use method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Such as Figure 1-5 As shown, the present embodiment provides a laser lead correction device, including a magazine 1 and a base 2, the magazine 1 is inserted into the base 2, the outer structure of the magazine 1 is a cuboid structure with an opening on the lower side, and the upper side of the magazine 1 is provided with There is a laser jack 3, and the bottom of the laser jack 3 is provided with an opening 11, and a support tube 5 is installed vertically under the opening 11. The inner diameter of the support tube 5 is consistent with the diameter of the opening 11. The base 2 includes a base plate 6 and a lead socket 7, and the base plate 6 is a rectangle whose size matches the lower opening of the material box 1. The lead wire socket 7 is vertically installed on one side of the base plate 6. The installation position of the lead wire socket 7 corresponds to the installation position of the support tube 5. The inside of the lead wire socket 7 is vertically provided wi...

Embodiment 2

[0038] A laser lead correction device, the structure of which is as described in Embodiment 1, the difference is that the inner wall of the laser socket 3 is provided with a positioning protrusion 4, and the positioning protrusion 4 matches the groove on the side of the substrate 10 on the laser 9, Reach fixed laser 9, limit its purpose of rotation.

Embodiment 3

[0040] A laser lead wire correction device, the structure is as described in Embodiment 1, the difference is that the upper end of the lead wire insertion hole 8 is funnel-shaped, and the lower end is cylindrical, and the inner diameter of the lead wire insertion hole 8 is larger than the outer diameter of the upper lead wire 12 of the laser 9. When 12 is skewed, it is guided by the funnel-shaped opening on the lead wire jack 8, and is gradually corrected under the reverse force, and then enters the lead wire jack 8 smoothly.

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Abstract

The invention relates to a laser lead correcting device and a using method, and belongs to the technical field of semiconductor laser packaging. The device comprises a material box and a base, the material box is inserted in the base, the external structure of the material box is a cuboid structure with an opening in the lower side, a laser jack is formed in the upper side of the material box, and an opening is formed in the bottom of the laser jack; the base comprises a bottom plate and a lead socket, the bottom plate is rectangular, the size of the bottom plate is matched with that of the opening in the lower side of the material box, the lead socket is vertically installed on one side of the bottom plate, and the installation position of the lead socket corresponds to the installation position of the supporting pipe. According to the invention, through cooperation of the material box and the base, skew lead correction is realized, a user can conveniently use automatic equipment to carry out feeding, assembling or welding, manual production is replaced, the production efficiency can be greatly improved, and losses such as pollution, electrostatic damage and the like which are possibly introduced by the manual production are reduced.

Description

technical field [0001] The invention relates to a laser lead line correction device and a use method, belonging to the technical field of semiconductor laser packaging. Background technique [0002] Compared with other forms of lasers such as solids, gases, and liquids, semiconductor lasers have developed rapidly since their birth. With their advantages such as small size, high efficiency, simple structure, and good reliability, semiconductor lasers have gradually become popular in process processing, communication, and interconnection. , sensor measurement, consumer entertainment and many other fields have emerged and gradually entered people's daily life. With the expansion of application fields and the decline of manufacturing costs, the use of low-power semiconductor laser products is gradually increasing. Therefore, downstream enterprises that need to use lasers to produce modules or complete machines have gradually introduced automation equipment to realize automatic l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/02345
Inventor 晏骁哲刘琦刘存志梁盼
Owner 潍坊华光光电子有限公司