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Laser packaging structure

A packaging structure and laser technology, applied in the direction of lasers, laser parts, semiconductor lasers, etc., can solve the problems of large thermal resistance and affect the heat dissipation effect, and achieve the effects of accelerating heat dissipation efficiency, improving heat dissipation effect, and reducing thermal resistance

Inactive Publication Date: 2021-06-22
SINO NITRIDE SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The mounting method between the laser diode and the nozzle is plane mounting, and the mounting places are all planes, and the thermal resistance is large, which affects the overall heat dissipation effect

Method used

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  • Laser packaging structure
  • Laser packaging structure
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Embodiment Construction

[0023] The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0024] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, ...

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Abstract

A laser packaging structure provided by the present invention comprises a tube tongue, a bonding layer installed on the tube tongue, a laser diode installed on the bonding layer, and a heat dissipation assembly installed on the tube tongue, the bonding layer is located between the tube tongue and the laser diode, the bonding layer is provided with a plurality of protruding parts arranged at intervals, the laser diode is provided with a plurality of first grooves which are arranged at intervals, and the protruding parts are matched with the first grooves; the tube tongue is provided with a heat dissipation cavity, the heat dissipation assembly comprises a matching part and a magnetic part which are installed in the heat dissipation cavity, a moving channel is formed between the matching part and the side wall of the heat dissipation cavity, and the magnetic part is located in the moving channel; and the heat dissipation effect of the laser diode is improved by increasing the contact area between the laser diode and the bonding layer, and the work of the laser diode under the high-power condition is facilitated.

Description

technical field [0001] The invention relates to the technical field of laser packaging, in particular to a laser packaging structure. Background technique [0002] Due to their small size, light weight, long life and high efficiency, semiconductor lasers are widely used in the fields of optical communication, optical pumping, optical storage and laser display. [0003] At present, the output power of semiconductor lasers is relatively small, which limits the application of semiconductor lasers. Therefore, the industry has been working on improving the output power of semiconductor lasers. At present, the main problem faced by high-power semiconductor lasers is that the temperature of the laser is too high under high-current injection, which leads to serious degradation of the semiconductor laser and seriously affects the stability and working life of the semiconductor laser. This phenomenon originates from the traditional TO socket including the tube shell. , a nozzle and a...

Claims

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Application Information

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IPC IPC(8): H01S5/024H01S5/02212H01S5/02315
CPCH01S5/02469H01S5/02476H01S5/02212
Inventor 李成明卢敬权颜建锋黄业王帅林逸
Owner SINO NITRIDE SEMICON