Novel carbon group internal cloth type heat conductor

Abstract

The invention discloses a novel carbon group internal cloth type heat conductor, and belongs to the technical field of novel carbon material heat conduction. The carbon heat conduction pipes are distributed between the inner substrate layer and the outer substrate layer in an array mode and embedded in the bonding heat conduction layer, so that the high heat conductivity of the thermal interface is effectively improved; meanwhile, a heat dissipation body is arranged in the carbon heat conduction pipe, the heat dissipation body is composed of a hollow refrigeration rod and a water storage rod which are distributed up and down, the bottom end of the hollow refrigeration rod is inserted into the water storage rod, the water storage rod is filled with cooling liquid, and the cooling liquid plays a role in cooling; when a certain high temperature is reached, the hollow refrigeration rod moves downwards under the expansion action of the heat conduction air bag, the lower end part of the hollow refrigeration rod is in contact with the cooling liquid in the water storage rod, the potassium nitrate powder in the hollow refrigeration rod is dissolved in the cooling liquid, and the temperature in the hollow refrigeration rod is suddenly reduced and local icing is realized, so a refrigeration effect is achieve, and the heat dissipation effect of the electronic device is effectively improved through the carbon heat conduction pipe, the bonding heat conduction layer and the inner substrate layer.

Description

technical field [0001] The invention relates to the technical field of heat conduction of new carbon materials, and more specifically, relates to a new type of carbon group inner cloth heat conductor. Background technique [0002] As the feature size of electronic devices enters the nanoscale, the integration of devices continues to increase, resulting in high power consumption and high temperature problems of chips. High power consumption and high temperature seriously affect circuit performance, reliability and chip packaging, so heat dissipation becomes the biggest stumbling block to whether the performance of the chip is good or not. [0003] At present, the realization of heat dissipation and heat conduction for electronic devices is to realize heat dissipation through direct contact of heat sinks. In order to solve the problem of heat conduction and heat dissipation of electronic devices, the industry installs radiators on the surface of electronic components to dissi...

AI Technical Summary

Problems solved by technology

However, for large-scale, high-power and high-consumption electronic devices, this traditional heat dissipation method using ordinary silicone grease and thermal interface materials formed by heat sinks is no longer sufficient to solve the high temperature problem of electronic devices.

Images