A kind of preparation method of conductive polymer composite material

Abstract

The invention discloses a method for preparing a conductive polymer composite material. Metals in a solid-liquid coexistence phase are mixed with polymer materials, and processed and shaped to prepare the conductive polymer composite material. This method uses the metal to be in the solid-liquid two-phase coexistence area in the metal phase diagram, and combines the solid-liquid coexistence phase with the polymer matrix to achieve the formation of a continuous contact phase of the metal in the polymer matrix, thereby achieving high conductivity of the material, and It is easy to process and form; the metal phase diagram is used to control the solid phase rate of the metal through the metal composition, processing temperature and the lever law of the metal phase diagram, thus making the performance of the composite material easy to control, achieving a range from 1×10 5 Ω·cm to 1×10 ‑7 Changes in Ω·cm.

Description

technical field [0001] The invention relates to a preparation method of a polymer composite material, in particular to a preparation method of a conductive polymer composite material. Background technique [0002] Conductive polymer usually refers to the conductivity of 10 -6 Polymer materials above S / cm have been widely used in modern electronic industries such as electronic sensors, displays, automotive electronics, and batteries. Due to the wide range of raw materials and simple preparation process, the physical mixing method has become the most important preparation method of conductive polymers. In the physical mixing method, metal materials (such as copper powder, silver powder, aluminum powder, etc.) are often filled into the polymer matrix as conductive particles. However, traditional metal fillers only have two states of pure solid and pure liquid, and there is an obvious interface between the solid phase and the liquid phase, and the change of properties at the i...

AI Technical Summary

Problems solved by technology

However, traditional metal fillers only have two states of pure solid and pure liquid, and there is an obvious interface between the solid phase and the liquid phase, and the change of properties at the interface is dramatic

Under processing conditions, pure liquid filling is non-conductive, pure solid filling has low conductivity (>1Ω·cm), and poor mechanical properties

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