Copper plating additive production process

Abstract

The invention discloses a copper plating additive production process, and relates to the technical field of electroplating production of circuit boards. The copper plating additive production process comprises the following steps: S1, blending a crystal grain refiner, a high-current density area additive and a low-current density area covering power enhancer according to proportions and quantifying the each reagent by using a weighing device, and mixing and stirring the raw materials to obtain initial solution A; S2, removing burrs of raw materials of the circular board by using a deburring machine, and separately drilling a via hole and an HDI blind hole on a point circuit board by using a data drilling machine; and S3, selecting a part of initial solution A to execute a hull cell experiment on the initial solution A; and detecting the large current representation and the addition amount of copper sulfate pentahydrate. According to the production process disclosed by the invention, by using the copper-plating additive, the cell liquid temperature, the hole conditioning capability, the copper plating time, the deep plating capability and the hole filling capability of the additive in electroplating working period can be improved, and the defect of the poor effect of existing copper-plating additives is overcome.

Description

technical field [0001] The invention relates to the technical field of circuit board electroplating production, in particular to a copper plating additive production process. Background technique [0002] Traditionally, the main application fields of electroplating are concentrated in machinery and light industry, etc. With the progress of electroplating technology and the increase of demand in other industries, in recent years, electroplating has gradually expanded to industries such as electronics, micro-electromechanical systems and steel, and this trend It is becoming more and more obvious that these emerging demands have higher requirements for electroplating, which can also better promote the development of the electroplating industry in the direction of intensification and scale, and promote the continuous advancement of electroplating industry technology. Electroplating is more and more widely used in the field of laminated printed circuit boards. With the expansion ...

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Problems solved by technology

[0003] The currently produced electroplating copper plating additives are restricted by the temperature of the bath, the ability of the whole hole, the copper plating time, the deep plating ability, the hole filling ability, etc., and the performance cannot reach the ideal level in the current industry. Therefore, the research and development has high efficiency. Copper plating additives with high depth ratio and high hole filling ability are imperative

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