Copper plating additive production process

A production process and additive technology, which is applied in the field of copper plating additive production process, can solve problems such as insufficient performance, achieve the effect of improving hole filling ability and solving insufficient effects

Pending Publication Date: 2021-06-25
ANSHAN TONGYI PHOTOELECTRIC TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The currently produced electroplating copper plating additives are restricted by the temperature of the bath, the ability of the whole hole, the copper plating time, the deep plating ability, the hole filling ability, etc.

Method used

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  • Copper plating additive production process
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  • Copper plating additive production process

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Embodiment Construction

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0022] It should be noted that, in the description of the present invention, the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", The orientation or positional relationship indicated by "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, not to indicate or imply ...

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PUM

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Abstract

The invention discloses a copper plating additive production process, and relates to the technical field of electroplating production of circuit boards. The copper plating additive production process comprises the following steps: S1, blending a crystal grain refiner, a high-current density area additive and a low-current density area covering power enhancer according to proportions and quantifying the each reagent by using a weighing device, and mixing and stirring the raw materials to obtain initial solution A; S2, removing burrs of raw materials of the circular board by using a deburring machine, and separately drilling a via hole and an HDI blind hole on a point circuit board by using a data drilling machine; and S3, selecting a part of initial solution A to execute a hull cell experiment on the initial solution A; and detecting the large current representation and the addition amount of copper sulfate pentahydrate. According to the production process disclosed by the invention, by using the copper-plating additive, the cell liquid temperature, the hole conditioning capability, the copper plating time, the deep plating capability and the hole filling capability of the additive in electroplating working period can be improved, and the defect of the poor effect of existing copper-plating additives is overcome.

Description

technical field [0001] The invention relates to the technical field of circuit board electroplating production, in particular to a copper plating additive production process. Background technique [0002] Traditionally, the main application fields of electroplating are concentrated in machinery and light industry, etc. With the progress of electroplating technology and the increase of demand in other industries, in recent years, electroplating has gradually expanded to industries such as electronics, micro-electromechanical systems and steel, and this trend It is becoming more and more obvious that these emerging demands have higher requirements for electroplating, which can also better promote the development of the electroplating industry in the direction of intensification and scale, and promote the continuous advancement of electroplating industry technology. Electroplating is more and more widely used in the field of laminated printed circuit boards. With the expansion ...

Claims

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Application Information

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IPC IPC(8): C25D3/38
CPCC25D3/38
Inventor 张健孟令旗杨曾光刘英帅李鹏丁兴城吴哲朱峰
Owner ANSHAN TONGYI PHOTOELECTRIC TECH
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