Temperature control method and system and storage medium

Abstract

The embodiment of the invention relates to the field of communication, and discloses a temperature control method and system and a storage medium. The method is applied to the temperature control system, the temperature control system comprises a chip, a refrigeration sheet, a heat dissipation sheet and an air cooling device; the chip is connected with the low-temperature end of the refrigeration sheet; the high-temperature end of the refrigeration sheet is connected with one end of the heat dissipation sheet; the other end of the heat dissipation sheet is connected with the air cooling device; the internal real-time working temperature of the chip is obtained; if the internal real-time working temperature of the chip is smaller than a first preset threshold value, temperature control is conducted on the chip through the air cooling device; and if the internal real-time working temperature of the chip is greater than or equal to the first preset threshold value, the technical means of carrying out temperature control on the chip through the refrigeration sheet and the air cooling device is adopted to improve the heat dissipation efficiency of the chip and accurately control the internal real-time working temperature of the chip, so that the chip can operate more stably and reliably.

Description

technical field [0001] Embodiments of the present invention relate to the field of communication technologies, and in particular, to a temperature control method, system, and storage medium. Background technique [0002] With the continuous development of Internet services and 5G communications, large-capacity, high-bandwidth communication devices continue to emerge, and the heat consumption of the equipment continues to increase, while the power consumption of communication service chips is also increasing, and the problem of heat dissipation is becoming more and more serious. more prominent. At present, equipment in the optical fiber communication industry is usually installed and operated in a rack in the form of a hardware single board. The main heat dissipation method adopted is to install heat sinks and fans on the surface of high-power devices for air cooling. [0003] However, fans, heat sinks, etc. are used to dissipate heat, mainly relying on the heat exchange bet...

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Problems solved by technology

[0003] However, fans, heat sinks, etc. are used to dissipate heat, mainly relying on the heat exchange between the heat sink and the air, which is largely affected by the ambient temperature and cannot provide a stable and optimal operating temperature for the chip; in addition, the heat in the rack cannot Dissipate in time, causing the ambient temperature to rise. At this time, the cooling effect of the heat sink and the fan is poor. The heat that cannot be dissipated will increase the temperature of the device body, so that the heat will be transferred to the PCB board through the chip body and pins, affecting other peripheral cores. device

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