Radio frequency module system-in-package structure and manufacturing method thereof and electronic equipment

Abstract

The invention discloses a radio frequency module system-in-package structure and a manufacturing method thereof, and electronic equipment. The radio frequency module system-in-package structure comprises a substrate, a filter chip, a passive element, a flexible plastic package film and a plastic package layer, wherein the substrate is provided with a first surface, the filter chip is arranged on the first surface, a first gap is formed between the filter chip and the first surface, the passive element is arranged on the first surface, the passive element and the filter chip are arranged at an interval, the flexible plastic package film is pasted on the surfaces of the first surface, the filter chip and the passive element, a first cavity is defined by the flexible plastic package film and the filter chip, and the plastic package layer covers the flexible plastic package film. According to the technical scheme, the processing method of the radio frequency module system-in-package structure is high in integration level and low in cost.

Description

technical field [0001] The invention relates to the field of packaging technology, in particular to a system-in-package structure of a radio frequency module, a manufacturing method thereof, and electronic equipment. Background technique [0002] Traditional filter packages generally use wafer-level filter packages, surface acoustic wave filters (SAW) or bulk acoustic wave filters (BAW) are flipped on ceramic substrates or organic substrates, and then polymer films and sheet resins are used once The press-fit creates a cavity, which can realize the conversion between the electric energy and the mechanical energy of the filter. However, due to the hard material of the polymeric film and sheet resin, the packaging workability is poor when the cavity is formed by one-time pressing. Generally, it can only be packaged in a single package, and other devices such as capacitors, resistors, amplifiers, and converters cannot be integrated, so it cannot be realized. system-in-package....

AI Technical Summary

Problems solved by technology

However, due to the hard material of the polymeric film and sheet resin, the packaging workability is poor when the cavity is formed by one-time pressing. Generally, it can only be packaged in a single package, and other devices such as capacitors, resistors, amplifiers, and converters cannot be integrated, so it cannot be realized. system in package

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