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Thin ceramic powder suitable for high-frequency assembly

A technology of ceramic powder and components, which is applied in the field of ceramic powder, can solve the problems that the volume is not easy to reduce, and the dielectric coefficient is not easy to increase, so as to achieve the effect of volume reduction

Inactive Publication Date: 2021-06-29
CHILISIN ELECTRONICS
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Problems solved by technology

[0002] At present, the general low-temperature microwave dielectric ceramic powder is mainly based on glass substrates. Due to the high amorphous content of glass, when the high frequency exceeds 1GHz, it will produce different dielectric coefficients (K values) and low Quality factor (Q value) characteristics, only when the dielectric coefficient of the material is too low, it is necessary to use more layers of ceramic layers to compensate the dielectric coefficient, which makes it difficult to increase the dielectric coefficient, and in order to increase the dielectric coefficient more It will cause the disadvantage that the volume is not easy to shrink

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  • Thin ceramic powder suitable for high-frequency assembly
  • Thin ceramic powder suitable for high-frequency assembly

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Embodiment 1

[0012] A ceramic powder suitable for thinning high-frequency components, comprising:

[0013] BaO-WO 3 -TiO 2 Low-temperature microwave dielectric ceramic powder, wherein the BaO content is about 10-60wt%, WO 3 The content is about 10-60wt%, TiO 2 The content is about 10-30wt%, and doped with 10wt% Ba-Zn-W-B-Si glass system, so it can form a material with a medium K value and a high Q value. After sintering, the sintered composition is measured at 10GHz. The K value is about 13-20 and the Q value is greater than 1000.

[0014] see figure 1 , figure 2 , is that the present invention compares with traditional type on material, figure 1 It is the microstructure of traditional low-temperature microwave dielectric ceramic powder, which is composed of figure 1 It can be seen that the traditional low-temperature microwave dielectric ceramic powder has high glass content and low ceramic content, please continue to read figure 2 , figure 2 Be the microstructure of the mater...

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Abstract

The invention discloses a thin ceramic powder suitable for a high-frequency component. The thin ceramic powder comprises BaO-WO3-TiO2 low-temperature microwave dielectric ceramic powder and a small amount of glass system to form a material with a medium K value and a high Q value, so that the K value of 13-20 and the Q value of more than 1000 can be generated during 10 GHz measurement, namely, by reducing the content of the glass system in the material, the K value can reach 13-20, and the Q value is high, so that the number of ceramic layers does not need to be increased in order to increase the K value, and the effect of reducing the size can be achieved.

Description

technical field [0001] The invention relates to a ceramic powder, in particular to a ceramic powder suitable for thinning high-frequency components. Background technique [0002] At present, the general low-temperature microwave dielectric ceramic powder is mainly based on glass substrates. Due to the high amorphous content of glass, when the high frequency exceeds 1GHz, it will produce different dielectric coefficients (K values) and low Quality factor (Q value) characteristics, only when the dielectric coefficient of the material is too low, it is necessary to use more layers of ceramic layers to compensate the dielectric coefficient, which makes it difficult to increase the dielectric coefficient, and in order to increase the dielectric coefficient more It will cause the disadvantage that the volume is not easy to shrink. [0003] Therefore, how to get rid of the above-mentioned deficiencies is the technical difficulty that the inventor of this case wants to solve. Con...

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Application Information

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IPC IPC(8): C04B35/495C04B35/01
CPCC04B35/495C04B35/01C04B2235/3232C04B2235/36C04B2235/96
Inventor 王世豪冯亦伟郑谨锋魏嘉言
Owner CHILISIN ELECTRONICS