Copper pre-plating method, copper plating method and copper plating device for superconducting strip

A technology of superconducting strip and pre-copper plating, which is applied in electrolysis process, electrolysis components, etc., can solve the problems that cannot solve the performance of the strip, and the bone structure of the strip affects the winding of the strip, so as to provide electroplating efficiency, power line Uniformity and non-concentration, the effect of improving processing efficiency

Pending Publication Date: 2021-07-09
SHANGHAI SUPERCONDUCTOR TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

If the surface of the superconducting strip is plated with sandy copper in the sand surface copper solution, the bone structure of the strip will affect the winding of the strip.
[0010] Patent document CN108342757B discloses a method for electroplating copper to prepare a high-temperature superconducting strip protective layer, which includes the following steps: step 1, preparing a copper prote

Method used

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  • Copper pre-plating method, copper plating method and copper plating device for superconducting strip
  • Copper pre-plating method, copper plating method and copper plating device for superconducting strip
  • Copper pre-plating method, copper plating method and copper plating device for superconducting strip

Examples

Experimental program
Comparison scheme
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Example Embodiment

[0073] Example 1:

[0074] The invention provides a superconducting strip pre-copper plating method, which is not only suitable for the electroplating operation of narrow strips, such as strip widths of 1 mm to 3 mm, but also suitable for wide strips, such as those with a width greater than 3 mm to be processed The strip 9 can achieve the effect of the present invention by using pre-plating. The superconducting strip pre-copper plating method is to use the first current to perform pre-copper plating treatment on the processed strip 9, wherein the pre-copper plating treatment The used pre-plating copper electroplating solution is added with pre-plating additives that allow it to work under the current density of the first current, and the current density used for the preset current is 6-20 A / dm 2 , the weight composition of described pre-copper electroplating solution is:

[0075] 200-240 copies of copper sulfate;

[0076] 50-70 parts of sulfuric acid;

[0077] 0.08-0.1 part...

Example Embodiment

[0092] Example 2:

[0093] This embodiment is a preferred example of Embodiment 1.

[0094] In this embodiment, the superconducting tape is first cleaned with pure water, and then the superconducting tape is subjected to the first current pre-copper plating treatment, the third current current bright copper plating treatment, and the second current current sand copper layer treatment, and then the superconducting tape is treated again. Pure water cleaning, passivation treatment, drying, drying to complete the copper plating operation of the superconducting tape.

[0095] After the superconducting tape is cleaned with ultrasonic pure water, the current density is 10A / dm 2 The current is used to quickly pre-plate the copper layer, so that the copper can quickly coat the surface of the double-sided silver-plated superconducting bare tape, and then use 2A / dm after pre-plating. 2 Electroplating the bright copper layer at a current density of 6A / dm to make the middle thick and smo...

Example Embodiment

[0097] Example 3:

[0098] This embodiment is another preferred example of Embodiment 1.

[0099] In this embodiment, the superconducting tape is transported in a linear arrangement, and after coming out from the discharging end of the discharging mechanism 1, it will first pass through a section of 60-180 cm adjustable ultrasonic pure water cleaning tank to clean the surface impurities, and continue The tape will pass through 2-8 copper-plating pre-plating tanks for rapid copper-plating cladding on the surface of the silver layer of the strip. The pre-plating copper plating solution used for the pre-plating is added with a limit of 6-20A / dm. 2 The pre-plating acid copper additive working at current density will continue to run through 6 to 36 bright copper plating tanks to increase the thickness of the uniform copper layer. The bright copper plating solution of the mother tank adds extra high leveling and dispersion. Capable of bright copper cuprate additive, use 0.5~3.5A / dm...

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Abstract

The invention provides a copper pre-plating method, a copper plating method and a copper plating device for a superconducting strip. The copper plating device for the superconducting strip comprises a discharging mechanism, a first cleaning mechanism, a copper pre-plating mechanism, a bright copper plating mechanism, a sand surface copper plating mechanism, a second cleaning mechanism, a passivation mechanism, a drying mechanism and a collecting mechanism. The discharging mechanism is used for unwinding the machined strip, the machined strip sequentially passes through the first cleaning mechanism, the copper pre-plating mechanism, the bright copper plating mechanism, the sand surface copper plating mechanism, the second cleaning mechanism, the passivation mechanism and the drying mechanism during machined and is wound on the collecting mechanism, the copper pre-plating mechanism adopts first current electroplating treatment, the bright copper plating mechanism adopts third current electroplating treatment, and the sand surface copper plating mechanism adopts second current electroplating treatment. By adopting the design of copper pre-plating, copper plating and the like, the problem that a superconducting layer is corroded by liquid is solved, and meanwhile, the electroplated superconducting strip is good in quality and high in electroplating efficiency.

Description

technical field [0001] The invention relates to the technical field of superconducting materials, in particular to a method for pre-plating copper on a superconducting strip, a copper-plating method and a copper-plating device. Background technique [0002] Since the first discovery of superconductivity in the laboratory by Professor Camerin Onners of Leiden University in the Netherlands in 1911, superconducting materials and their applications have been one of the most active frontier research fields in contemporary science and technology. In the past ten years, the research on superconducting power devices based on superconductivity has developed rapidly. In superconducting energy storage, superconducting motors, superconducting cables, superconducting current limiters, superconducting transformers, superconducting magnetic levitation, Remarkable achievements have been made in fields such as nuclear magnetic resonance. [0003] High-temperature superconducting materials a...

Claims

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Application Information

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IPC IPC(8): C25D3/38C25D5/10C25D5/18C25D5/34C25D5/48C25D7/06C25D17/00
CPCC25D3/38C25D5/10C25D5/18C25D5/48C25D7/0621C25D17/00C25D5/34
Inventor 朱佳敏张超虞兴洲赵大允陈思侃吴蔚赵跃丁逸珺
Owner SHANGHAI SUPERCONDUCTOR TECH CO LTD
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