Jig

Abstract

The present invention provides a jig. The height of the heat dissipation substrate of the packaging structure can be limited, the risk of solder overflow in the reflow soldering process is reduced, and the yield of the packaging structure is improved. The jig comprises a base, a cover plate and a pressing plate. First limiting structures are arranged on the two sides, close to the first side edge and the second side edge, of the first face of the base correspondingly. Second limiting structures are arranged on the two sides, close to the third side edge and the fourth side edge, of the first face of the base correspondingly. Third limiting structures are arranged on the two sides, close to the third side edge and the fourth side edge, of the first face of the base respectively, each third limiting structure is provided with a step structure, and the step faces of the third limiting structures are used for supporting the second heat dissipation substrate. The cover plate covers the first surface of the base, and the cover plate is provided with a notch for exposing the second heat dissipation substrate; and the pressing plate is arranged on the face, away from the base, of the cover plate, a plurality of protruding blocks are arranged on the face, facing the base, of the pressing plate, and the protruding blocks can stretch into the notches and abut against the second heat dissipation substrate.

Description

technical field [0001] The present application relates to the technical field of mechanical equipment, in particular to a jig. Background technique [0002] In many fields such as power systems, data centers, electric vehicles, and new energy applications, it is a common method to use power electronic equipment to achieve energy conversion. Power semiconductor devices, as the basic components of power electronic converters, play a vital role in it. important role. Semiconductor devices are usually packaged on a heat-dissipating substrate to form a packaging structure, and then assembled on a circuit board of a power electronic device. After the stacking of the multi-layer structure including heat dissipation substrates and semiconductor devices on the package structure is completed, the stacked package structure can be fixed on the corresponding fixture, and then the fixture carrying the package structure is placed on the reflow soldering machine. Reflow soldering to fix t...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, the jigs used to realize the reflow soldering process of the packaging structure generally only have the positioning function. During the high-temperature reflow soldering process, the packaging structure is prone to large warping deformation due to the influence of thermal stress, and the upper and lower heat dissipation substrates Due to the stacking of multi-layer structures, the height is not easy to control, and many undesirable phenomena such as flashing and cracking of the heat dissipation substrate are prone to occur when the packaging structure is plastic-sealed, which seriously affects the yield of the product.

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