Jig
A fixture and one-sided technology, applied in the field of fixtures, can solve problems affecting product yield, fracturing of heat dissipation substrates, flashing, etc., and achieve the effect of reducing the risk of warpage
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[0066] In order to make the purpose, technical solution and advantages of the application clearer, the application will be further described in detail below in conjunction with the accompanying drawings.
[0067] In many fields such as power systems, data centers, electric vehicles, and new energy applications, it is a common method to use power electronic equipment to achieve energy conversion. Power semiconductor devices, as the basic components of power electronic converters, play a vital role in it. important role.
[0068] refer to figure 1 as shown, figure 1 It is a schematic structural diagram of a package structure provided by the embodiment of the present application. The packaging structure 100 includes a first heat dissipation substrate 110, a semiconductor device 120, a conductive support column 130, a second heat dissipation substrate 140, and a lead frame 150. The first heat dissipation substrate 110 can be used to carry a semiconductor device 120 and to dissip...
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