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A Directional Coupler Based on Through-Silicon Via Technology

A directional coupler and through-silicon via technology, applied in waveguide-type devices, circuits, connecting devices, etc., can solve the problems of large physical size, inability to integrate circuits, and difficulties in miniaturization and integration of radio frequency circuits. , performance improvement, good coupling effect

Active Publication Date: 2022-04-15
河北鹏博通信设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because traditional passive devices have large physical dimensions and cannot be integrated with circuits, the miniaturization and integration of radio frequency circuits has always been an insurmountable problem

Method used

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  • A Directional Coupler Based on Through-Silicon Via Technology
  • A Directional Coupler Based on Through-Silicon Via Technology
  • A Directional Coupler Based on Through-Silicon Via Technology

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Embodiment Construction

[0023] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0024] A directional coupler based on silicon communication technology, such as figure 1 , 2 As shown, the upper oxidation layer 8, the silicon substrate 7, and the lower oxidation layer 10 provided from the top to bottom, and the center of the silicon substrate 7 is provided in the vertical direction TSV-I copper column 6 and in the vertical direction, respectively. The upper and lower ends of the TSV-II copper column 9, the upper and lower ends of the TSV-I copper column 6 are respectively disposed in the horizontal RDL-I1 and the lower layer RDL-I2, and the upper and lower ends of the TSV-II copper column 9 are provided in the horizontal direction. RDL-II3 and lower RDL-II4; the outer wall of the TSV-I copper column 6 and the TSV-II copper column 9 coated with an oxidizing isolation layer 5. The upper oxidation layer 8, the silicon substrate 7 a...

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Abstract

The invention discloses a directional coupler based on through-silicon via technology, which comprises an upper oxide layer, a silicon substrate and a lower oxide layer arranged in sequence from top to bottom. Parallel TSV‑I and TSV‑II, the upper and lower ends of TSV‑I are respectively provided with upper layer RDL‑I and lower layer RDL‑I along the horizontal direction, and the upper and lower ends of TSV‑II are respectively arranged with upper layer RDL‑II along the horizontal direction and the lower layer RDL‑II; the outer walls of the copper pillars of TSV‑I and TSV‑II are coated with an oxide isolation layer and buried in the silicon substrate. The invention adopts the through-silicon hole technology to greatly reduce the volume of the traditional microstrip directional coupler, realizes the miniaturization of the coupler, has better high-frequency characteristics, and can work at the terahertz frequency.

Description

Technical field [0001] The present invention belongs to the technical field of three-dimensional integrated circuit, and is directed to a directional coupler based on a silicon vent. Background technique [0002] Directional coupler is a wide range of passive microwave devices that enable directional coupling in the microwave system, widely used in the field of microwave millimeters such as power measurement, power monitoring, power distribution and synthesis. This shows that the directional coupler is active in the composition of the microwave system, and is used in the radio frequency circuit design for power distribution or combination. The orientation coupler is a four-port device, with a characteristic of unsettled transmit and four ports, which is mainly measured by three parameters of isolation, coupling degree, and directionality. [0003] A variety of couplet structures in recent years appear in people's field of view, such as a waveguide, a stripline or a microstrip lin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01P5/18
CPCH01P5/18
Inventor 王凤娟肖洒余宁梅杨媛朱樟明尹湘坤
Owner 河北鹏博通信设备有限公司