Packaging adhesive film with high PID resistance and preparation method thereof

A packaging film, high resistance technology, applied in the direction of adhesives, film/sheet adhesives, non-polymer adhesive additives, etc., can solve the problem of long lamination time, slow cross-linking speed, increased haze, etc. Problems, to achieve excellent bonding performance, good effect, high optical performance

Active Publication Date: 2021-07-16
CYBRID TECHNOLOGIES INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above two methods have disadvantages: the price of POE film is high, the crosslinking speed is slow, and the required lamination time is long; adding ion trapping additives will affect the optical properties of the film, resulting in increased haze
However, the anti-PID effect of the encapsulation film provided by it needs to be further improved

Method used

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  • Packaging adhesive film with high PID resistance and preparation method thereof
  • Packaging adhesive film with high PID resistance and preparation method thereof
  • Packaging adhesive film with high PID resistance and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] The highly PID-resistant encapsulating adhesive film of this embodiment includes an upper adhesive film layer, a barrier layer and a lower adhesive film layer arranged in sequence from top to bottom, at least one of the upper adhesive film layer and the lower adhesive film layer is added with anti-hydrolysis Additives and ion traps.

[0055] The thickness of the adhesive film layer is 300 μm, and the adhesive film layer contains the following components in parts by mass:

[0056]

[0057] The barrier layer has a thickness of 50 μm, specifically an ETFE film.

[0058] The thickness of the lower adhesive film layer is 300 μm, and in parts by mass, the lower adhesive film layer comprises the following components:

[0059]

[0060]

[0061] The preparation method of the high-PID-resistant encapsulating adhesive film of this embodiment includes the following steps: purchase a commercially available transparent ETFE film of 50 μm, and cast the upper and lower adhesi...

Embodiment 2

[0063] The highly PID-resistant encapsulating adhesive film of this embodiment includes an upper adhesive film layer, a barrier layer and a lower adhesive film layer arranged in sequence from top to bottom, at least one of the upper adhesive film layer and the lower adhesive film layer is added with anti-hydrolysis Additives and ion traps.

[0064] The thickness of the adhesive film layer is 300 μm, and the adhesive film layer contains the following components in parts by mass:

[0065]

[0066] The barrier layer has a thickness of 50 μm, specifically an ETFE film.

[0067] The thickness of the lower adhesive film layer is 300 μm, and in parts by mass, the lower adhesive film layer comprises the following components:

[0068]

[0069] The preparation method of the high-PID-resistant encapsulating adhesive film of this embodiment includes the following steps: purchase a commercially available transparent ETFE film of 50 μm, and cast the upper and lower adhesive films acc...

Embodiment 3

[0071] The highly PID-resistant encapsulating adhesive film of this embodiment includes an upper adhesive film layer, a barrier layer and a lower adhesive film layer arranged in sequence from top to bottom, at least one of the upper adhesive film layer and the lower adhesive film layer is added with anti-hydrolysis Additives and ion traps.

[0072] The thickness of the adhesive film layer is 300 μm, and the adhesive film layer contains the following components in parts by mass:

[0073]

[0074]

[0075] The barrier layer has a thickness of 50 μm, specifically an ETFE film.

[0076] The thickness of the lower adhesive film layer is 300 μm, and in parts by mass, the lower adhesive film layer comprises the following components:

[0077]

[0078] The preparation method of the high-PID-resistant encapsulating adhesive film of this embodiment includes the following steps: purchase a commercially available transparent ETFE film of 50 μm, and cast the upper and lower adhesi...

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Abstract

The invention provides a packaging adhesive film with high PID resistance and a preparation method thereof. The packaging adhesive film with high PID resistance comprises an upper adhesive film layer, a barrier layer and a lower adhesive film layer which are sequentially arranged from top to bottom, and at least one of the upper adhesive film layer and the lower adhesive film layer is added with a hydrolysis-resistant auxiliary agent and an ion trapping agent. The packaging adhesive film with high PID resistance is good in PID resistance effect, excellent in adhesive property and optical property and higher in generated power.

Description

technical field [0001] The invention belongs to the technical field of adhesive films, and relates to an encapsulating adhesive film and a preparation method thereof, in particular to an anti-PID encapsulating adhesive film and a preparation method thereof, in particular to a highly PID-resistant encapsulating adhesive film and a preparation method thereof. Background technique [0002] The packaging material of solar cell modules can provide protection for solar cell modules. However, the widely used packaging material is ethylene-vinyl acetate copolymer (EVA) with a single-layer structure. In a long-term high-temperature and high-humidity environment, EVA is easily hydrolyzed Destruction, resulting in a significant decrease in the bonding between EVA and glass interface, resulting in potential safety hazards in solar cell modules. Solar cell modules have been used in a high-voltage environment for a long time. Wet leakage current channels are easily generated between packa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J123/08C09J11/04C09J11/06C09J7/24C09J7/30H01L31/048
CPCC09J123/0853C09J123/0815C09J11/04C09J11/06C09J7/243C09J7/245C09J7/30H01L31/0481C08K2003/328C08K2003/2224C09J2203/322C09J2423/046C09J2423/04C09J2427/006C08K13/02C08K3/32C08K3/22C08K5/29Y02E10/50
Inventor 王磊胡求学闫烁韩晓航李新军陈洪野吴小平
Owner CYBRID TECHNOLOGIES INC
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