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Light source plate and preparation method thereof and display device

A light source board and substrate technology, which is applied in the direction of instruments, optics, semiconductor devices, etc., can solve the problems of cumbersome Mini-LED chip technology, etc., and achieve the effect of improving welding yield, improving positioning accuracy, and high welding strength

Pending Publication Date: 2021-07-16
TCL CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The main purpose of the present invention is to provide a method for preparing a light source board, which aims to solve the problem of cumbersome processes in the packaging and welding process of Mini-LED chips in the existing light source board

Method used

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  • Light source plate and preparation method thereof and display device
  • Light source plate and preparation method thereof and display device
  • Light source plate and preparation method thereof and display device

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0033] A preparation method of a light source plate, such as figure 1 shown, including the following steps:

[0034] S01. Provide a substrate, on which a plurality of target positions are preset at intervals, each of the target positions is used to fix an LED chip, and the target positions include two electrodes;

[0035] S02. Deposit insulating pads on the plurality of target positions, and each of the insulating pads is disposed between two electrodes corresponding to the target positions;

[0036] S03. Deposit a mixed layer on the insulating pad, where the mixed layer includes: packaging resin and solder balls;

[0037] S04. Place the LED chip on the target position, wherein the LED chip is placed corresponding to the two electrodes of the target target position;

[0038] S05. Solder and fix each of the LED chips on the substrate.

[0039] The preparation method of the light source board provided by the embodiment of the present invention is to deposit insulating pads on...

Embodiment approach

[0063] As an implementation manner, the mixed layer further includes: fluorescent powder;

[0064] Wherein, the weight percentage of the fluorescent powder is 10%-30%, the weight percentage of the packaging resin is 10%-50%, and the weight percentage of the solder ball is 30%-60%;

[0065] Phosphor powder is added to the mixed layer. On the one hand, the phosphor powder is lighter than the tin ball, so that the phosphor powder in the mixture can be cured with the packaging resin to form a fluorescent glue that wraps the LED chip; on the other hand, the phosphor powder can convert the light emitted by the chip. Color, by using this feature to achieve flexible adjustment of the light color of the light source board, the flexible adjustment of the light color of the backlight can be realized in the absence of quantum dot films, reducing the use of expensive quantum dot materials, and at the same time, in the preparation of RGB For the three-color backlight, only LED chips with lo...

Embodiment 1

[0121] In this embodiment, a monochromatic light source board is prepared, which specifically includes the following steps:

[0122] (1) Deposit insulating pads on the substrate

[0123] A substrate is provided, and a plurality of target positions are preset at intervals on the substrate, and each target position is used to fix an LED chip, and the target positions include positive poles and negative poles;

[0124] Preset a stencil, such as Figure 5 As shown, the stencil is provided with a plurality of through holes, and each through hole is arranged between the positive electrode and the negative electrode corresponding to the target position; the stencil is placed on the substrate, and each of the through holes corresponds to a target position ;

[0125] A thixotropic silica gel layer is coated on the steel mesh, so that the thixotropic silica gel is printed on the substrate through the through hole to form a thixotropic silica gel layer; the steel mesh is removed, and t...

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Abstract

The invention belongs to the technical field of display, and particularly relates to a light source plate and a preparation method thereof and a display device. The preparation method provided by the invention comprises the steps: providing a substrate, wherein a plurality of target positions are preset on the substrate at intervals, each target position is used for fixing an LED chip, and each target position comprises two electrodes; depositing insulating pads on the plurality of target positions, wherein each insulating pad is arranged between the two electrodes of the corresponding target position; depositing a mixed layer on the insulating pad, wherein the mixed layer comprises packaging resin and solder balls; placing a LED chip at the target position, wherein the LED chip is placed corresponding to the two electrodes of the target position; and welding and fixing each LED chip on the substrate. According to the invention, the two procedures of welding and packaging are achieved in the same step, so that the preparation technology of the light source plate is greatly simplified, and the obtained light source plate is firm in welding, high in welding yield and flexible and adjustable in light color.

Description

technical field [0001] The invention belongs to the field of display technology, and in particular relates to a light source plate, a preparation method thereof and a display. Background technique [0002] Mini-LEDs (Mini-LED) are products with a chip size below 200 microns. Due to the advantages of high resolution, ultra-thin surface, high contrast and wide color gamut, Mini-LEDs are often used in LCD display backlights in the market. At present, the Mini-LED backlights on the market are mainly direct-type backlights, which are mainly composed of Mini-LED light source boards and quantum dot films. Mini-LED light source boards include: substrates and Mini-LED chips arrayed on the substrates , when the light emitted by the Mini-LED chip irradiates the quantum dot film, the quantum dot is excited to emit monochromatic light or RGB three-color light, thereby providing a light source board for the LCD screen. [0003] However, since there are often thousands of chips and tens o...

Claims

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Application Information

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IPC IPC(8): H01L25/075H01L33/48H01L33/54G02F1/13357
CPCH01L25/0753H01L33/483H01L33/54G02F1/133603H01L2933/005H01L2933/0033
Inventor 马刚
Owner TCL CORPORATION
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