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Microphone packaging structure and method for preparing microphone packaging structure

A packaging structure and microphone technology, which is applied to sensors, electrostatic transducers, microphones, electrical components, etc., can solve the problems of cracking of the welding structure of the cover body and the substrate, the decrease of sensitivity and signal-to-noise ratio, and the cracking of the silicon diaphragm. Small size, improved sensitivity and signal-to-noise ratio, and improved performance

Active Publication Date: 2021-09-21
FOREHOPE ELECTRONICS NINGBO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Existing MEMS silicon wheat products, because the silicon diaphragm on the MEMS chip is very sensitive to changes in sound pressure, the external sound pressure in the prior art is directly in contact with the silicon diaphragm on the MEMS chip, so when the intensity of the sound pressure change exceeds a certain value , the silicon diaphragm will be broken due to the impact of high-intensity sound pressure. At the same time, during the cutting process, it is easy to have the problem that the substrate warps when the cover is being cut, resulting in the cracking of the welding structure between the cover and the substrate. Moreover, the conventional packaging structure is adopted. larger size
In addition, the existing silicon mic products usually only use a single-sound cavity design, and the sound enters the MEMS chip and the metal cover from a single hole / single direction (back sound input / front sound input). When the sound signal is very weak, the sound The weaker the pressure signal, the lower the sensitivity and signal-to-noise ratio of MEMS silicon wheat products

Method used

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  • Microphone packaging structure and method for preparing microphone packaging structure
  • Microphone packaging structure and method for preparing microphone packaging structure
  • Microphone packaging structure and method for preparing microphone packaging structure

Examples

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no. 1 example

[0047] see figure 1 , the present embodiment provides a microphone package structure 100, which has a small package size, can avoid the problem of substrate warping, and can prevent the silicon diaphragm from being broken due to high-intensity sound pressure impact, effectively protecting the silicon diaphragm, and The sensitivity, signal-to-noise ratio, and frequency response of the silicon microphone are improved, and the performance of the silicon microphone is improved.

[0048] The microphone packaging structure 100 provided in this embodiment includes a functional substrate 110, a silicon microphone chip 130, a first cover 150, a second cover 170, and a carrier substrate 190. The carrier substrate 190 is provided with an accommodating groove 191, and the silicon microphone The chip 130 is mounted on one side of the functional substrate 110, and the first cover 150 is also mounted on one side of the functional substrate 110, and is covered on the silicon chip 130, and the...

no. 2 example

[0062] see figure 2, this embodiment provides a microphone packaging structure 100, its basic structure and principle and the technical effect produced are the same as those of the first embodiment, for a brief description, the parts not mentioned in this embodiment can refer to the first embodiment corresponding content. The difference between this embodiment and the first embodiment lies in the opening position of the first back sound hole 111 .

[0063] In this embodiment, a plurality of first sound-rearing holes 111 are provided on the bottom wall of the carrying substrate 190 and the accommodating groove 191, and the plurality of first sound-rearing holes 111 on the functional substrate 110 surround the first cover. Around the body 150 and the second cover 170, a plurality of first back sound holes 111 located on the bottom wall of the accommodation groove 191 surround the projection of the first cover 150 on the bottom wall of the accommodation groove 191, And each of...

no. 3 example

[0068] see image 3 , this embodiment provides a microphone packaging structure 100, its basic structure and principle and the technical effect produced are the same as those of the first embodiment, for a brief description, the parts not mentioned in this embodiment can refer to the first embodiment corresponding content. The difference between this embodiment and the first embodiment lies in the opening position of the first back sound hole 111 .

[0069] In this embodiment, the carrier substrate 190 is provided with a plurality of first sound-rearing holes 111 , and the plurality of first sound-rearing holes 111 are arranged on the bottom wall of the accommodating groove 191 and surround the first cover 150 Around the projection on the bottom wall of the accommodating groove 191 , the plurality of first sound-rearing holes 111 correspond to between the first cover 150 and the sidewall of the accommodating groove 191 .

[0070] In this embodiment, the first cover 150 is sp...

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Abstract

Embodiments of the present invention provide a microphone packaging structure and a method for preparing the microphone packaging structure, which relate to the technical field of microphone packaging. The microphone packaging structure includes a functional substrate, a silicon wheat chip, a first cover, a second cover and a carrier substrate , the carrying substrate is provided with accommodating grooves, by opening the accommodating grooves, the first cover can be accommodated in the accommodating grooves, thereby reducing the overall packaging volume, reducing the size of packaged products, and the functional substrate Mounted on the carrier substrate, the problem of warpage of the substrate will not occur between the functional chip and the first cover during cutting. And the front cavity of the silicon microphone chip is formed through the first cover to guide the transmission of sound pressure, and the second cover forms the back cavity of the silicon microphone chip, which improves the air space on the back of the silicon microphone chip, thereby improving the sensitivity and signal-to-noise of the silicon microphone ratio, while also improving the frequency response of silicon microphones.

Description

technical field [0001] The invention relates to the technical field of microphone packaging, in particular to a microphone packaging structure and a method for preparing the microphone packaging structure. Background technique [0002] With the rapid development of the semiconductor industry, microphones have been widely used in various electronic products in the consumer field, among which silicon microphones have been widely used in mobile terminals due to their small size and strong stability. A silicon microphone includes a MEMS (Micro Electro Mechanical System, Micro Electro Mechanical System) chip, and the MEMS chip includes a silicon diaphragm and a silicon back plate. Among them, the working principle of the MEMS chip is to use the pressure gradient generated by the sound change to make the silicon diaphragm deformed by the sound pressure interference, and then change the capacitance value between the silicon diaphragm and the silicon back plate, thereby converting t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R19/00H04R19/04H04R31/00
CPCH04R19/005H04R19/04H04R31/00H04R2201/003
Inventor 何正鸿钟磊李利
Owner FOREHOPE ELECTRONICS NINGBO CO LTD
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