Forming preparation process of intelligent wireless communication equipment heat dissipation device
A technology for wireless communication equipment and heat-dissipating parts is applied in the field of forming and manufacturing technology of heat-dissipating parts for intelligent wireless communication equipment, which can solve the problems of difficulty in guaranteeing the yield of heat sinks, poor product quality, low production efficiency of enterprises, etc., so as to avoid deformation and shaking, Improve drilling accuracy, avoid shaking and sliding effect
Active Publication Date: 2021-07-20
SUZHOU SUTUO COMM TECH
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Problems solved by technology
[0005] In view of the problems in the prior art, the purpose of the present invention is to provide a molding and preparation process for heat sinks of intelligent wireless communication equipment, which solves the problem that it is difficult to batch prepare and shape heat sinks in the mass production of heat sinks in enterprises. And for each heat sink processed in batches, it is difficult to ensure the yield rate of each heat sink after it is prepared and molded, which will easily cause technical problems such as low production efficiency and poor product quality.
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[0053] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further elaborated below in conjunction with specific drawings. It should be noted that, in the case of no conflict, the embodiments and Features in the embodiments can be combined with each other.
[0054] see Figure 1-13 It is a schematic diagram of the overall structure of the molding and preparation process of heat dissipation devices for intelligent wireless communication equipment;
[0055] A molding and preparation process for heat dissipation components of intelligent wireless communication equipment, comprising the following steps:
[0056] S1. Arrangement of heat sinks: Arrange multiple heat sinks that need to be formed and processed in a row in a straight line. During the discharge process, make the base of each heat sink above the heat sink and place the heat sink downwards;
[0057] S2. Pushing of ...
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The invention provides an forming preparation process of an intelligent wireless communication equipment heat dissipation device, and relates to the technical field of wireless communication equipment production. The process comprises the following steps: S1, radiating fins placement: a plurality of radiating fins needing to be formed are arranged into a straight line in rows, a radiating fin base of each radiating fin is enabled to be located at the upper part in the arrangement process, and the radiating fins are placed downwards; S2, the cooling fins are pushed, specifically, the multiple cooling fins which are arranged into a straight line in rows in the step S1 are pushed in order, the cooling fins arranged in rows are made to move forwards by pushing the cooling fins on one side, and the forefront cooling fin is subjected to forming machining. Through staggered reciprocating motion between a cutting piece and a polishing piece which are vertically intersected, longitudinal ditching and transverse polishing between multiple layers of cooling fins are achieved, multiple procedures are completed through one-time installation of the cooling fins, and the forming preparation efficiency of the cooling fins is improved.
Description
technical field [0001] The invention relates to the technical field of wireless communication equipment production, in particular to a molding and preparation process for heat dissipation components of intelligent wireless communication equipment. Background technique [0002] Intelligent wireless communication equipment such as main box, switch, large router and other equipment are all intelligent wireless communication equipment. No matter what kind of intelligent wireless communication equipment, its body has a chassis. The chassis can be used to protect the normal work of internal components, which is convenient For functions such as transfer, in order to ensure that each component can work normally, it is often necessary to install heat dissipation devices inside the main chassis. There are many common heat dissipation devices, such as cooling fans, heat conduction copper tubes, heat conduction fins, and heat sinks. And other components, the existing heat sinks of diffe...
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IPC IPC(8): B23P15/26
CPCB23P15/26
Inventor 丁兴杰
Owner SUZHOU SUTUO COMM TECH