Machining device

Abstract

The invention provides a machining device which can restrain increase of cost and restrain reduction of machining precision. The machining device includes a machining feed unit and a control unit. The machining feed unit moves a holding unit along guide rails between a machining zone, and an imaging zone in which a workpiece is imaged by a camera. The control unit includes a correction amount calculation section configured such that, after forming a cut groove in the workpiece, the cut groove is imaged by the camera, and correction values in a Y-axis direction or a correction angle for the chuck table are or is then calculated from Y-coordinates of two points apart from each other in a machining feed direction on the cut groove, whereby when carrying out machining feed of the chuck table in the imaging zone, the camera is corrected in position in the Y-direction based on the correction values or the chuck table is rotated by the correction angle.

Description

technical field [0001] The invention relates to processing devices. Background technique [0002] There is known a processing apparatus that processes a workpiece such as a device wafer, such as silicon, sapphire, gallium arsenide, SiC (silicon carbide), and the like, in which various devices are formed in areas divided by the lanes along the lanes ( For example, refer to Patent Document 1). Such a processing device is a cutting tool that is mounted on a spindle to cut the road, or a laser processing device that focuses laser light on the road to form a laser-processed groove or a modified layer inside. [0003] In the above processing device, the workpiece is held on the chuck table and processed while moving in the processing feed direction (X-axis direction) along the guide rail. At this time, if the chuck table is rotated so that the direction of the partition road is parallel to the X-axis direction, machining along the partition road can be performed by moving the ch...

AI Technical Summary

Problems solved by technology

[0005] In the above-mentioned processing device, the chuck table is moved by a linear actuator that moves the holding unit (movable base) along the guide rail, but the linear motion of the linear actuator is only at the sides other than both ends. Guaranteed within the guaranteed range, compared with the guaranteed range, the linearity is poor near both ends of the guide rail, and the chuck table rotates slightly or performs machining feed in a rotating state when viewed from above (observed from the camera)

Therefore, when aligning the workpiece (determining the processing position) or performing notch inspection (measurement and adjustment of the positional deviation of the cutting position) in the area of ​​​​the two ends, there is a fear that the wrong position will be processed and the processing accuracy will be reduced.

However, if the guaranteed range is extended to both ends or the length of the linear actuator is increased to expand the guaranteed range, the cost of the linear actuator will increase or the area required for installation will increase.

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