Surface chip mounting process

Abstract

The invention provides a surface chip mounting process. The surface chip mounting process comprises the following steps of: S1, providing a wafer, preparing a first bonding pad on the surface of the wafer, planting a solder ball with the same height on the first bonding pad located on the surface of the wafer, conducting welding to obtain a wafer with a surface planted with the solder ball, and then cutting the wafer to obtain a chip having the solder ball with the same height; S2, providing a flexible film and manufacturing a second bonding pad on the surface of the flexible film, wherein an isolation layer is arranged between the second bonding pad and the flexible film; S3, mounting chip with the solder ball on the surface of the flexible film in a surface mounting mode, welding the solder ball on the chip to the second bonding pad on the surface of the flexible film through reflow soldering, and combining the flexible film with a mold in the reflow soldering process so as to obtain solder ball distribution identical with the surface morphology of the mold; and S4, separating the solder ball together with the second bonding pad from the flexible film to obtain a chip with surface solder ball height matched with the curved surface of a base. According to the invention, the problem of sealing-off is reduced.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a surface chip mounting process. Background technique [0002] The planar chip technology can interconnect the chip with BGA solder balls with the base (such as PCB or substrate) with pads on the surface. This technology requires the plane of BGA solder balls to be in the same plane, and the difference in height is small. , it is also required that the plane of the base pad is also in the same planarity. [0003] However, with the application in some special areas, especially the popularization of artificial wearable products, more and more electronic modules have changed from flat to curved, which requires the welding technology of chips to change from flat to curved, especially when the base When the surface is curved before soldering, only a part of the BGA solder balls with a flat chip surface can be soldered to the pad, and other areas will be desoldered due to insuf...

AI Technical Summary

Problems solved by technology

[0003] However, with the application in some special areas, especially the popularization of artificial wearable products, more and more electronic modules have changed from flat to curved, which requires the welding technology of chips to change from flat to curved, especially when the base When the surface is curved before soldering, only a part of the BGA solder balls with a flat chip surface can be soldered to the pad, and other areas will be desoldered due to insufficient distance

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