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Solder alloy, solder paste, solder preform and solder joint

A technology of brazing joints and preforms, which is applied in the direction of welding equipment, welding media, welding/cutting media/materials, etc., and can solve problems such as semiconductor chip damage

Active Publication Date: 2021-07-23
SENJU METAL IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, the stress during cooling is concentrated on the semiconductor chip and not on the solder joint, so the problem of semiconductor chip breakage gradually arises

Method used

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  • Solder alloy, solder paste, solder preform and solder joint
  • Solder alloy, solder paste, solder preform and solder joint
  • Solder alloy, solder paste, solder preform and solder joint

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0122] A solder alloy having an alloy composition shown in Table 1 was adjusted to prepare a test substrate. The presence or absence of chip cracks after reflow soldering was observed, the area ratio of voids was obtained, and the shear strength at high temperature was evaluated as bonding strength. In addition, in each alloy composition, the precipitation amount of each compound was calculated|required from the area ratio of each compound.

[0123] ・Evaluation of the presence or absence of chip cracks

[0124] The solder alloys in Table 1 were atomized to form solder powders. Soldering flux (manufactured by Senju Metal Co., Ltd., product name: D128) composed of rosin, solvent, activator, thixotropic agent, organic acid, etc. was mixed to prepare a solder paste of each solder alloy. The content of the solder alloy powder in this solder paste was 90% relative to the total mass of the solder paste. After printing the solder paste on a Cu substrate with a thickness of 3.0mm us...

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PUM

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Abstract

Provided is a solder alloy, a solder paste, a solder preform, and a solder joint which suppress chip cracks during cooling, improve heat dissipation characteristics of the solder joint, and also display a high degree of joining strength at a high temperature. The solder alloy has an alloy composition comprising, in mass%, 9.0-33.0% Sb, more than 4.0% and less than 11.0% Ag, more than 2.0% and less than 6.0% Cu, and the remainder is Sn. Moreover, the solder paste, the solder preform, and the solder joint all contain said solder alloy.

Description

technical field [0001] The present invention relates to a Sn-Sb-Ag-Cu based solder alloy, and a solder paste having a Sn-Sb-Ag-Cu based solder alloy, a solder preform and a solder joint. Background technique [0002] Conventionally, Si has been mainly used as a material for semiconductor chips. In recent years, the requirements for semiconductor characteristics have become higher, and the use environment has gradually become more severe, and they are being replaced by SiC, GaAs, GaN, etc. Each of these semiconductor chips has excellent characteristics of a packaged semiconductor element, and can be used in optical devices such as power transistors and LEDs. [0003] These semiconductor elements can be operated at high temperatures, and the solder joints between them and substrates and the like sometimes reach a temperature of about 250 to 280°C. Therefore, high-temperature solders that do not melt during operation of semiconductor elements are sought. In addition, semicond...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C13/02B23K35/22B23K35/26
CPCC22C13/02B23K35/262B23K35/025B23K35/0244B23K1/0016B23K2101/40
Inventor 立花芳惠坂本健志
Owner SENJU METAL IND CO LTD