Supercharge Your Innovation With Domain-Expert AI Agents!

Connecting board, circuit board assembly and electronic equipment

一种电路板组件、电子设备的技术，应用在印刷电路组件、印刷电路零部件、电气连接印刷元件等方向，能够解决发散、很难调试收敛、信号大插入损耗等问题

Pending Publication Date: 2021-07-30
HUAWEI TECH CO LTD
View PDF10 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the characteristic impedance of the wiring in the traditional connection board structure cannot be controlled, which will make the signal transmission discontinuous, resulting in a large insertion loss during signal transmission, and the Smith chart (also known as the Smith chart) Divergent, difficult to debug convergence

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Connecting board, circuit board assembly and electronic equipment
  • Connecting board, circuit board assembly and electronic equipment
  • Connecting board, circuit board assembly and electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0052] Embodiments of the present application are described below with reference to the accompanying drawings in the embodiments of the present application.

[0053] see figure 1 , the present application provides an electronic device 100 . The electronic device 100 involved in the embodiment of the present application may be any device with communication and storage functions, such as: tablet computer, mobile phone, e-reader, remote control, personal computer (Personal Computer, PC), notebook computer, vehicle-mounted device, network Smart devices with network functions such as TVs and wearable devices. The embodiments of the present application are described by taking the electronic device 100 as an example for description.

[0054] see figure 1 , the electronic device 100 includes a casing 200 and a circuit board assembly 300 . The circuit board assembly 300 is accommodated in the casing 200 . The housing 200 is used to protect the circuit board assembly 300 . The cir...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Provided are a connection board (3), a circuit board assembly (300) and an electronic device (100). The connection board (3) comprises a board body (31), a signal transmission part (32) and a grounding part (33). The board body (31) is provided with a signal transmission hole (311) and at least one grounding hole (312). The signal transmission hole (311) extends from one end (314) of the board body (31) to the other end (315) of the board body (31). The signal transmission part (32) is arranged in the signal transmission hole (311). The at least one grounding hole (312) extends from one end (314) of the board body (31) to the other end (315) of the board body (31), and the extension path of the at least one grounding hole (312) is the same as that of the signal transmission hole (311). The at least one grounding hole (312) surrounds the signal transmission hole (311) and is arranged at an interval with the signal transmission hole (311), and the grounding part (33) is arranged in the at least one grounding hole (312). The connecting board (3) can accurately control the characteristic impedance.

Description

technical field [0001] The present application relates to the field of electronic products, in particular to a connection board, a circuit board assembly and an electronic device. Background technique [0002] With the development of technology, consumers' demand for electronic products is getting higher and higher, and R&D personnel's demand for miniaturized printed circuit board (Printed Circuit Board, PCB) design is also becoming stronger and stronger. Multilayer printed circuit board stacking design System architecture is also more popular with developers. [0003] While this printed circuit board architecture brings miniaturization benefits, it also introduces some new problems. Among these problems, how to solve the signal connection between different printed circuit boards, especially the connection of radio frequency signals, is very critical . A multilayer printed circuit board connects two printed circuit boards using a connection board in which traces are used t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/11H05K1/14H05K5/00
CPCH05K1/144H05K1/115H05K1/145H05K1/0222H05K1/0219H05K1/0243H05K1/02H05K3/429H05K2201/042H05K2201/10378H05K2201/2036H05K2201/09809H05K2201/09618H05K2201/10128H05K2201/09854H05K5/0017
Inventor 王辉邱丹陈志君唐戴平
Owner HUAWEI TECH CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com