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Low thermal expansion alloy excellent in low temperature stability and manufacturing method thereof

A low thermal expansion, manufacturing method technology, applied in the direction of manufacturing tools, additive manufacturing, metal processing equipment, etc., can solve the problems of unstably obtained, unobtained materials, etc.

Active Publication Date: 2022-02-18
NIPPON CHUZO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] However, according to the examples of Patent Document 2, except for No. 7, no material with a thermal expansion coefficient of about 0.4 ppm / °C and stable zero expansion has been obtained.
In addition, for machines operating in the low-temperature region, the lower the temperature at which low-temperature stability can be obtained, the better. It is ideal to have the same stability as the Invar alloy. In the case of the alloy of Patent Document 2, it is not possible to stably obtain the same stability as the Invar alloy. The equivalent Ms point is below -196°C

Method used

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  • Low thermal expansion alloy excellent in low temperature stability and manufacturing method thereof
  • Low thermal expansion alloy excellent in low temperature stability and manufacturing method thereof
  • Low thermal expansion alloy excellent in low temperature stability and manufacturing method thereof

Examples

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Embodiment

[0075] Hereinafter, examples of the present invention will be described.

[0076] Test materials were prepared by lamination molding alloys with the chemical composition and composition shown in Table 1 and by casting in pure copper molds.

[0077] As for the test material of laminated molding, by melting an alloy with the chemical composition shown in Table 1 with a high-frequency induction furnace, use figure 1 In the atomization device shown, molten metal is dropped, and an inert gas (nitrogen gas in this example) is sprayed from a nozzle to rapidly solidify the droplets while splitting them to obtain a spherical powder. Thereafter, sieving was carried out to obtain figure 2 Modeling powder with a particle size of 10 to 45 μm shown. Using a laser-type laminated molding device, under the conditions of an output power of 300W, a laser moving speed of 1000mm / s, a laser scanning distance of 0.1mm, and a powder laminate thickness of 0.04mm, the laminated molding is performed ...

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Abstract

The present invention provides a low thermal expansion alloy containing, in mass %, C: 0.015% or less, Si: 0.10% or less, Mn: 0.15% or less, Ni: 35.0 to 37.0%, Co: less than 2.0%, and Ni +0.8Co: 35.0-37.0%, the remainder is composed of Fe and unavoidable impurities, the alloy has a solidification structure with a secondary dendrite arm spacing of 5 μm or less, and an average thermal expansion coefficient of 0±0.2 at 100-70°C In the range of ppm / °C, and the Ms point is below -196°C.

Description

technical field [0001] The present invention relates to a low-thermal-expansion alloy excellent in low-temperature stability and a method for producing the same. Background technique [0002] Low thermal expansion alloy materials are suitable for suppressing thermal deformation of precision devices in various cutting-edge fields with changes in temperature. When the thermal expansion coefficient is 0, it becomes an ideal material because no thermal deformation with temperature changes occurs. [0003] Parts of aerospace and space equipment and measuring equipment operate in low-temperature regions, and are sometimes used at temperatures below -100°C. It is necessary that the coefficient of thermal expansion does not change drastically with changes in the structure even in such a low-temperature region, and that the coefficient of thermal expansion between 100°C and -70°C is in the range of 0±0.2ppm / °C, which can be regarded as practically zero expansion within the alloy ma...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C38/00B22F10/20B22F3/16B22F9/08B33Y10/00B33Y70/00C22C38/10
CPCB33Y70/00B33Y10/00B22F10/20B22F2998/10C22C38/08C22C38/105C22C38/04C22C38/02Y02P10/25B22F9/082B22F10/28B22F3/105B22F3/16B22F9/08C22C38/10B23K26/342B22F2301/35C22C33/0285
Inventor 半田卓雄刘志民大山伸幸鹫尾胜
Owner NIPPON CHUZO
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