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Self-adaptive control platform for grinding

A control platform and self-adaptive technology, applied in the control of workpiece feed movement, grinding machines, manufacturing tools, etc., can solve the problems of reduced grinding efficiency, affecting the quality of grinding, and the inability to accurately adjust the size of the processing contact surface, etc., to achieve change The effect of the size of the machining contact force and the small grinding contact force

Inactive Publication Date: 2021-08-13
HEBEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, at present, after the workpiece is mechanically polished, the grinding effect of the workpiece cannot be monitored in real time, and the influence of the size of the processing contact surface on the grinding cannot be effectively analyzed, so that when the workpiece is polished, the size of the processing contact surface cannot be accurately adjusted, which reduces the grinding efficiency. It also affects the grinding quality

Method used

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  • Self-adaptive control platform for grinding
  • Self-adaptive control platform for grinding
  • Self-adaptive control platform for grinding

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Embodiment 1: The pressure control device 1 is fixed in the bracket 2.4 of the image recognition processing device 2, the processing robot 3 is fixed in the bracket 2.4, and the grinding head 4 is fixed in the processing robot 3 ends.

[0029] Pressure control device - 1; box - 1.1; embossed press placement box - 1.1.1; drainage chamber - 1.1.2; press - 1.2; processing table - 1.3; sensor - 1.4; hot blowing device - 1.5; Flushing device-1.6; image recognition processing device-2; slide table-2.1; camera-2.2; image processing device-2.3; bracket-2.4; processing robot-3; grinding head-4; drain hole-5.

Embodiment 2

[0030] Embodiment 2: When in use, the processing robot 3 is installed on the processing table 1.3, and the camera 2.2 is adjusted to a reasonable position through the sliding table, which is beneficial to feature extraction of the processing surface, and the processing robot 3 passes The grinding head 4 grinds the workpiece, and the lifting of the processing table 1.3 by the press 1.2 changes the size of the contact force between the grinding head 4 and the workpiece, and the camera 2.2 responds to different contact forces. The features of the polished surface are extracted and uploaded to the image processing device 2.3 to evaluate the processed surface, and the evaluation results and contact force are transmitted to the control system of the image processing device 2.3. To find the optimal grinding contact force based on the surface characteristics of the teaching staff.

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Abstract

The invention discloses a self-adaptive control platform for grinding. The self-adaptive control platform for grinding comprises a pressure control device, a picture recognition processing device, a machining robot and a grinding head, the pressure control device comprises a box body, a press machine, a machining table, a sensor, a hot air blowing device and a flushing device, the picture recognition processing device comprises a sliding table, a camera, a picture processing device and a support, the pressure control device is fixed to the left end of the inner bottom end face of the support, the camera is located right above the machining table, the machining robot is fixed to the right end of the inner bottom end face of the support, and the grinding head is fixed to the end part of a robot arm of the machining robot. According to the self-adaptive control platform for grinding, the position of the camera can be adjusted, extraction is advantageously carried out on surface features of a machined surface, and rapidly collecting and processing are carried out on the machined surface, and the machining table is lifted through the press machine, the machining contact force is changed, and the grinding contact force is accurately adjusted.

Description

technical field [0001] The invention relates to the technical field of grinding devices, in particular to a grinding adaptive control platform. Background technique [0002] Grinding is a kind of surface modification technology. It generally refers to a processing method that uses rough physics to change the physical properties of the material surface through friction. The main purpose is to obtain a specific surface roughness. However, at present, after the workpiece is mechanically polished, the grinding effect of the workpiece cannot be monitored in real time, and the influence of the size of the processing contact surface on the grinding cannot be effectively analyzed, so that when the workpiece is polished, the size of the processing contact surface cannot be accurately adjusted, which reduces the grinding efficiency. It also affects the grinding quality. Contents of the invention [0003] In view of the above defects or deficiencies in the prior art, it is desired t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B27/00B24B49/12B24B49/16B25J11/00
CPCB24B27/0084B24B49/12B24B49/165B25J11/0065
Inventor 韩旭陶友瑞黄震
Owner HEBEI UNIV OF TECH
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