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Underfill adhesive for chip packaging and chip packaging structure

An underfill, paraxylene technology, used in adhesives, epoxy resins, semiconductor/solid-state device parts, etc., can solve the problems of poor adhesion of underfills, achieve good fixation and protection, and high reliability. and long-term use

Active Publication Date: 2021-08-24
WUHAN CHOICE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] This application provides an underfill adhesive, the purpose of which is to improve the problem of poor adhesion of the existing underfill adhesive

Method used

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  • Underfill adhesive for chip packaging and chip packaging structure
  • Underfill adhesive for chip packaging and chip packaging structure
  • Underfill adhesive for chip packaging and chip packaging structure

Examples

Experimental program
Comparison scheme
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preparation example Construction

[0037] In at least one embodiment, the preparation method of the underfill with strong adhesion comprises the following steps:

[0038]Step S1: Add epoxy resin, filler, curing agent, pigment and accelerator into the mixing cup according to a certain proportion;

[0039] Step S2: Use a centrifugal mixer to stir for 90-300s at a speed of 800 r / min in rotation and 1200 r / min in revolution to obtain a mixture;

[0040] Step S3: Put the mixture into a three-roll mill, and roll mill to obtain a uniformly dispersed bottom filler, wherein, the feeding gap of the three rollers of the three-roll mill is 30-60 μm, and the discharging gap is 10- 30 μm.

[0041] Step S4: Use a centrifugal mixer to vacuum defoam the uniformly dispersed underfill glue, wherein the vacuum defoaming time is 30-60s, the rotation speed of the centrifugal mixer is 800 r / min, and the revolution speed is 1200 r / min.

[0042] see figure 1 The embodiment of the present application also provides a chip packaging st...

Embodiment 1

[0047] Silica 60%

[0048] Complex high-tech EPLS-818S (bisphenol A type, hydroxyl equivalent 80) 24.4%

[0049] Hardener (1) 8%

[0050] Hardener (2) 7%

[0051] Carbon black 0.1%

[0052] Benzyldimethylamine 0.5%

Embodiment 2

[0054] Silica 55%

[0055] Complex high-tech EPLS-818S (bisphenol A type, hydroxyl equivalent 80) 19.4%

[0056] Hardener (1) 13%

[0057] Hardener (2) 12%

[0058] Carbon black 0.1%

[0059] Benzyldimethylamine 0.5%

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Abstract

The invention discloses an underfill adhesive for chip packaging, which is prepared from the following components in percentage by mass: 19 to 25 percent of epoxy resin, 55 to 60 percent of a filler, 15 to 25 percent of a curing agent and 0.5 to 0.8 percent of an accelerant, wherein the curing agent comprises a polycondensate of p-xylene and dihydroxyl naphthalene and a polycondensate of p-xylene and naphthol. According to the underfill adhesive for chip packaging disclosed by the invention, two polycondensates: the polycondensate of p-xylene and dihydroxy naphthalene and the polycondensate of p-xylene and naphthol are selected, so that the underfill adhesive has relatively high adhesiveness after being cured. In addition, the invention also provides a chip packaging structure using the underfill adhesive.

Description

technical field [0001] The present application relates to the technical field of semiconductor packaging, in particular to an underfill glue and a chip package structure using the underfill glue. Background technique [0002] Flip chip is to turn the semiconductor chip over and connect the solder joints to the substrate by welding to realize the conduction of the circuit. This method is different from the traditional method, which is to wire around the chip and connect it to the circuit board through gold wires or copper wires. The advantage of flip chip is that the chip size is small, because the solder joint is shorter than the traditional gold wire, the transmission loss is reduced, the signal transmission is faster, and the heat conduction effect is better. [0003] In order to meet the reliability requirements of electronic devices, flip chips generally use underfill technology. Underfill is a material suitable for flip-chip underfill technology. It usually uses the p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C09J11/04C08G59/62H01L23/29
CPCC09J163/00C09J11/04C08G59/621H01L23/295C08K3/36C08G59/4007C08L63/00H01L24/81H01L24/16H01L24/29H01L24/32H01L24/73H01L2224/16221H01L2224/2929H01L2224/29387H01L2224/32221H01L2224/73204H01L2924/0665
Inventor 伍得王圣权王义廖述杭苏峻兴
Owner WUHAN CHOICE TECH CO LTD