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Interpolation mechanism for laser scribing device and scribing device using the interpolation mechanism

A scribing device and interpolation technology, applied in laser welding equipment, welding equipment, metal processing equipment, etc., can solve the problems of high price and lack of compatibility of electronic scanners

Inactive Publication Date: 2021-08-31
MITSUBOSHI DIAMOND IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In addition, the price of the galvano scanner is high, especially there is no compatibility with the control system of the scribing device, so there is the inconvenience of having to apply a new program that makes the control program of the galvano scanner compatible with the control program of the scribing device

Method used

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  • Interpolation mechanism for laser scribing device and scribing device using the interpolation mechanism
  • Interpolation mechanism for laser scribing device and scribing device using the interpolation mechanism
  • Interpolation mechanism for laser scribing device and scribing device using the interpolation mechanism

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Embodiment Construction

[0030] Next, an embodiment of the present invention will be described in more detail with reference to the drawings.

[0031] figure 1 It is a plan view for explaining the purpose and principle of laser beam irradiation position interpolation.

[0032] The basic purpose of performing interpolation is to form scribe lines at accurate positions on the brittle substrate 100 . That is, if figure 1 As shown, even if the first belt conveyor 13 moves horizontally in the Y direction and the brittle substrate 100 located at the lower part of the horizontal moving table 17 is in a skewed state, considering the degree of skewing, the light beam emitting part that moves in the X direction is also simultaneously Move in the Y direction.

[0033] Regarding this interpolation, the amount of deviation ΔY (in the Y direction along the X direction) between the virtual straight line 100a connecting the alignment mark 100e and the moving route 100b of the laser irradiation unit 30 itself is ca...

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PUM

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Abstract

The invention discloses an interpolation mechanism for a laser scribing device and a scribing device using the interpolation mechanism. The interpolation mechanism is used for adjusting the light path of a laser beam in the vertical downward direction in a conveyor-type scribing device and adjusting the position of a light point in the conveying direction of a conveyor. The scribing device comprises a conveyor, namely a substrate transfer unit, which horizontally transfers a substrate; a horizontal moving table that moves in a direction orthogonal to the transfer direction of the substrate; a laser oscillator arranged on the horizontal moving table and emitting a laser beam; and an interpolation mechanism which is slidably disposed on the horizontal moving table, receives the laser beam, guides the laser beam toward the substrate in a vertically downward direction, adjusts a light path in the vertically downward direction, and adjusts the position of a light point.

Description

technical field [0001] The present invention relates to a laser scribing device for dividing and processing brittle substrates. More specifically, it relates to an interpolation mechanism that improves the accuracy of scribing by interpolating the position of laser irradiation and a scribing device using the interpolation mechanism. line device. Background technique [0002] A scribing device is used as a tool for cutting various thin brittle substrates including glass substrates into necessary sizes. The scribing device is a device that forms scribe lines on the substrate surface using a laser irradiation unit and a scribing wheel. After forming the scribe lines, for example, a bending force can be applied to the substrate centering on the scribe lines to cut the substrate. [0003] For example, the wheel scribing device has the following basic structure: a control unit, a platform supporting a brittle substrate to be processed, a guide rail horizontally arranged above the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/364B23K26/08B23K26/70
CPCB23K26/0884B23K26/364B23K26/702
Inventor 金仁泽
Owner MITSUBOSHI DIAMOND IND CO LTD
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