Preparation method of low-temperature curing conductive copper paste

Abstract

A preparation method of low-temperature curing conductive copper paste belongs to the field of flexible electronics. The conductive copper paste comprises the following raw materials by mass: 20%-53% of a copper salt, 0.25%-5% of nano copper powder, 0.1%-3% of a binder, 10%-30% of a solvent, and 35%-55% of a reducing agent. The preparation method comprises the following steps of: firstly adding the binder into the solvent to form a mixed solution, then adding the copper salt and the nano-copper powder into the mixed solution, finally adding the reducing agent to form mixed paste, and controlling the viscosity of the mixed paste to be 10 Pa.s to 60 Pa.s; adding the mixed paste into a planetary stirrer, stirring for 20-60 minutes, and carrying out primary dispersion; and adding the mixed paste obtained after primary dispersion into a three-roller mill for secondary dispersion. The obtained conductive copper paste can be subjected to low-temperature curing at the temperature of 180 DEG C or below and is suitable for circuit printing or electronic element preparation in flexible devices, all raw materials are nontoxic and harmless, and the green production requirement is met.

Description

technical field [0001] The invention belongs to the field of flexible electronics, and in particular relates to a preparation method of low-temperature curing conductive copper paste. Background technique [0002] In recent years, with the continuous development of electronic products in the direction of lightness, smallness, thinness and flexibility, flexible circuits that can meet the requirements of lightness, smallness, thinness and flexibility at the same time have been favored by scientific researchers, especially one of the core materials of flexible circuits ——Flexible electronic paste has also been developed by leaps and bounds. Compared with low-temperature curing conductive silver paste, low-temperature curing conductive copper paste has attracted more and more attention from domestic and foreign enterprises for its advantages of low cost and high conductivity. [0003] At present, there are still many problems in the low-temperature curing conductive copper past...

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Problems solved by technology

Invention patent "low-temperature sintered copper paste, preparation method and application" (CN 112940564 A), the phenyl glycidyl ether and cyclohexanone used have certain toxicity to the environment or human body; "a low-temperature conductive copper paste and its "Preparation method" (CN 109979686 A) uses silver-coated copper powder, the cost is high, and the particle size of the powder used is 5-15 μm, the curing temperature cannot reach below 200 °C, and the curing temperature is high

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