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Chemical mechanical polishing retaining ring and machining method thereof

A processing method and chemical mechanical technology, applied in metal processing equipment, work carriers, manufacturing tools, etc., can solve the problems of low processing efficiency, low yield, easy fracture, etc., to reduce downtime, low friction coefficient and Amount of wear, effect of avoiding breakage

Pending Publication Date: 2021-09-07
上海江丰平芯电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Due to the particularity of the retaining ring material, it is very easy to break during the preparation and processing process, resulting in scrapped products, low yield and low processing efficiency.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] This embodiment provides a chemical mechanical polishing retaining ring and a processing method thereof, the processing method comprising the following steps:

[0047] (1) The epoxy resin adhesive produced by Araldite Company is used to bond the retaining ring to be processed and the SUS304 stainless steel back plate to obtain the assembly to be processed;

[0048] (2) Use four 6-32UNC screws to fix the assembly to be processed obtained in step (1) on the fixture and use a dial gauge to perform alignment; the flatness of the assembly to be processed after the alignment is 0.01mm , the concentricity is 0.02mm;

[0049] (3) adopt the milling cutter of tungsten steel alloy material to carry out rough milling and finish milling successively to the to-be-processed assembly after step (2) gained alignment treatment; The cutting speed of described rough milling is 1350r / min, and feed rate is 25mm / min, the cutting amount is 0.1mm; the cutting speed of the finish milling is 135...

Embodiment 2

[0054] This embodiment provides a chemical mechanical polishing retaining ring and a processing method thereof, the processing method comprising the following steps:

[0055] (1) The epoxy resin adhesive produced by Araldite Company is used to bond the retaining ring to be processed and the SUS304 stainless steel back plate to obtain the assembly to be processed;

[0056] (2) Use four 6-32UNC screws to fix the assembly to be processed obtained in step (1) on the fixture and use a dial indicator to perform alignment; the flatness of the assembly to be processed after the alignment is 0.02mm , the concentricity is 0.01mm;

[0057] (3) adopt the milling cutter of tungsten steel alloy material to carry out rough milling and fine milling successively to the assembly to be processed after step (2) gained alignment treatment; The cutting speed of described rough milling is 1200r / min, and feed rate is 30mm / min, the cutting amount is 0.15mm; the cutting speed of the finish milling is ...

Embodiment 3

[0062] This embodiment provides a chemical mechanical polishing retaining ring and a processing method thereof, the processing method comprising the following steps:

[0063] (1) The epoxy resin adhesive produced by Araldite Company is used to bond the retaining ring to be processed and the SUS304 stainless steel back plate to obtain the assembly to be processed;

[0064] (2) Use four 6-32UNC screws to fix the assembly to be processed obtained in step (1) on the fixture and use a dial gauge to perform alignment; the flatness of the assembly to be processed after the alignment is 0.01mm , the concentricity is 0.03mm;

[0065] (3) adopt the milling cutter of tungsten steel alloy material to carry out rough milling and finish milling successively to the assembly to be processed after step (2) gained alignment treatment; The cutting speed of described rough milling is 1500r / min, and feed rate is 20mm / min, the cutting amount is 0.05mm; the cutting speed of the finish milling is 15...

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PUM

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Abstract

The invention provides a chemical mechanical polishing retaining ring and a machining method thereof. The machining method comprises the following steps that a to-be-machined retaining ring is bonded to a back plate to obtain a to-be-machined assembly; (2), the to-be-machined assembly obtained in the step (1) is fixed and aligned; (3), milling treatment is carried out on the to-be-machined assembly subjected to alignment treatment in the step (2), wherein the to-be-machined retaining ring in the step (1) is made of carbon fiber reinforced polyether-ether-ketone. According to the machining method, the phenomenon that the retaining ring is broken in the machining process is avoided, so that product scrapping is avoided, and the rate of finished products and the machining efficiency are improved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor manufacturing, and relates to a chemical mechanical polishing retaining ring, in particular to a chemical mechanical polishing retaining ring and a processing method thereof. Background technique [0002] Chemical mechanical polishing is the mainstream surface planarization method in the field of semiconductor manufacturing. It is very important to control the uniformity of wafer surface thickness, and the uniformity of wafer surface thickness directly affects the electrical performance parameters of electronic devices. Uneven thickness will make the same wafer The performance of the devices produced on the above-mentioned devices has a large difference, which in turn affects the yield. [0003] In the chemical mechanical polishing process, the wafer with the abrasive liquid on the surface is fixed on the polishing pad on the turntable for relative movement. Through the chemical action of th...

Claims

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Application Information

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IPC IPC(8): B24B37/32B23C3/00
CPCB24B37/32B23C3/00
Inventor 姚力军潘杰惠宏业王学泽李力平
Owner 上海江丰平芯电子科技有限公司