Method for manufacturing electronic component

Abstract

The present invention provides a method for manufacturing an electronic component, the method including securing a brittle substrate to a support and separating the brittle substrate from the support, and being such that it is possible to prevent damage to the brittle substrate during separation from the support. This method for manufacturing an electronic component includes processing a workpiece secured to a support, wherein the method moreover includes providing at least one thermal release layer between the support and the workpiece and securing the workpiece, processing the surface of the secured workpiece that is on the reverse side from the thermal release layer, and heating the thermal release layer after processing to thereby separate the workpiece from the support.

Description

technical field [0001] The present invention relates to a method of manufacturing electronic components. Background technique [0002] Conventionally, in the manufacturing process of an electronic component, when processing a board|substrate, it fixes this board|substrate to a support body, and wax is often used as a fixing material. After the predetermined processing is completed, the substrate as the object to be processed is separated from the support by heating and melting the wax. [0003] In recent years, hard and brittle substrates (hard and brittle substrates) such as sapphire wafers have sometimes been used as substrates. However, as described above, if the substrate is fixed with wax, cracking of the hard and brittle substrate is likely to occur during separation after processing. and other bad situations. This is considered to be because the wax melted by heating has high viscosity and excessive load is placed on the substrate during the operation of separating ...

AI Technical Summary

Problems solved by technology

[0003] In recent years, hard and brittle substrates (hard and brittle substrates) such as sapphire wafers have sometimes been used as substrates. However, as described above, if the substrate is fixed with wax, cracking of the hard and brittle substrate is likely to occur during separation after processing. and other bad situations

This is considered to be because the wax melted by heating has high viscosity, and when the substrate is separated (sliding the substrate in the horizontal direction, picking up the substrate in the vertical direction, etc.), it places an excessive load on the substrate.

This problem becomes noticeable especially after processing such as thinning hard and brittle substrates by grinding / grinding

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