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Composition and method for fabrication of nickel interconnects

A composition and interconnection technology, applied in the field of metal electrodeposition, can solve the problems of reducing the performance and reliability of integrated circuits

Pending Publication Date: 2021-09-07
麦克德米德乐思公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Microcracks and macrocracks within the applied deposits expose the integrated circuit to corrosion and ultimately degrade the performance and reliability of the integrated circuit

Method used

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  • Composition and method for fabrication of nickel interconnects

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0112] Example 1: Preparation of an exemplary nickel electrolyte composition comprising the following components:

[0113] MacDermid Enthone Nickel Sulfamate LIQ 20 Concentrate (150g / L Ni) - 485mL / L

[0114] Sulfamic acid-1.7g / L

[0115] Boric acid-30g / L

[0116] Nickel bromide solution-55mL / L

[0117] 08-0.5g / L

[0118] MacDermid Enthone Brightener 63 (Accelerator or Depolarizer) - 3mL / L

[0119] The pH of the electrolyte was adjusted to 4.0 using a 50 g / L sulfamic acid solution, and the electrolyte was heated to 55°C. A 2 cm x 2 cm coupon with a 23 micron diameter and 30 micron deep via with a copper seed layer and patterned photoresist was taped to a stainless steel coupon holder, immersed in electrolyte and charged at a current density of 5 ASD And the electrode was rotated at a rotation rate of 100 RPM for 10 minutes for electroplating. The photoresist was stripped, and a SEM cross section showed that the via was filled to about 50%.

Embodiment 2

[0120] Example 2: The same electrolyte as in Example 1 was prepared by adding 2 mL / L of compound S2 (a heterocyclic betaine (polarizer) with a molecular weight less than 500). The photoresist was stripped, and a SEM cross-section showed that the via was filled to about 60%.

Embodiment 3

[0121] Example 3: The same electrolyte as in Example 1 was prepared by adding 4 mL / L of compound S2. The photoresist was stripped, and a SEM cross-section showed that the via was filled to about 100%.

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Abstract

A nickel electrodeposition composition for via fill or barrier nickel interconnect fabrication comprises (a) a source of nickel ions; (b) one or more polarizing additives; and (c) one or more depolarizing additives. The nickel electrodeposition composition may include various additives, including suitable acids, surfactants, buffers, and / or stress modifiers to produce bottom-up filling of vias and trenches.

Description

technical field [0001] The present invention generally relates to compositions and methods for the electrodeposition of metals, especially nickel and nickel alloys. The compositions and methods are useful for metallization of vias and trenches in microelectronic devices, and for multiple nickel interconnect applications such as nickel pillars, nickel bumps, UBM barriers, and RDL metallization applications. Background technique [0002] Integrated circuits are fabricated from semiconductor substrates having multiple devices including, for example, transistors, capacitors, and resistors interconnected into circuits. Interconnects typically include metal traces that connect these devices on the substrate. Similarly, multilayer printed circuit boards are made of conductive metal layers sandwiched between dielectric layers and semiconductor layers that need to be interconnected by vias or vias. [0003] Metal-filled vias allow three-dimensional (3D) stacking, connecting various...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D7/12C25D3/12H01L21/283H01L21/288H01L21/768
CPCC25D3/12C25D7/12H01L21/2885H01L21/76877H01L21/76898C25D7/123C25D5/02C25D7/00C25D3/18C25D21/10
Inventor 埃里克·雅各布森孙绍鹏埃利·纳贾尔T·理查德森文森特·帕内卡西奥邵文波凯尔·惠滕
Owner 麦克德米德乐思公司
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