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Sacrificial protection layer for environmentally sensitive surfaces of substrates

A sacrificial protection, substrate technology, used in biocide-containing paints, antifouling/underwater coatings, electrical components, etc., can solve problems such as material modification, defects, adverse effects of downstream processing, etc.

Pending Publication Date: 2021-09-07
LAM RES CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Exposure during transfer and / or storage may result in defects, material modification, and / or adversely affect downstream processing

Method used

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  • Sacrificial protection layer for environmentally sensitive surfaces of substrates
  • Sacrificial protection layer for environmentally sensitive surfaces of substrates
  • Sacrificial protection layer for environmentally sensitive surfaces of substrates

Examples

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Embodiment Construction

[0032] Substrate surfaces may be exposed to ambient conditions during semiconductor fabrication. Many substrate surfaces are susceptible to modification by ambient or environmental exposure. The resulting surface changes may adversely affect subsequent processing and / or degrade device performance. This exposure phenomenon may be referred to herein as the latency effect.

[0033] To manage latency effects, integrated substrate processing tools have been developed to allow processing in a highly controlled environment with little or no exposure to the surrounding environment. This approach typically requires substantial design changes to the substrate processing tool. Furthermore, there are substantial logistical issues when taking the integrated substrate processing tool offline for repair.

[0034] Another approach for mitigating the effect of latency is to control the environment during transfer. For example, front opening wafer transfer pods (FOUPS) may be modified to pr...

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Abstract

A method for protecting a surface of a substrate during processing includes a) providing a solution forming a co-polymer having a ceiling temperature; b) dispensing the solution onto a surface of the substrate to form a sacrificial protective layer, wherein the co-polymer is kinetically trapped to allow storage at a temperature above the ceiling temperature; c) exposing the substrate to ambient conditions for a predetermined period; and d) de-polymerizing the sacrificial protective layer by using stimuli selected from a group consisting of ultraviolet (UV) light and heat.

Description

[0001] incorporated by reference [0002] The PCT application form is filed as part of this application at the same time as this specification. Each application from which this application claims the benefit or priority, as identified in the concurrently filed PCT application form, is hereby incorporated by reference in its entirety for all purposes. technical field [0003] The present disclosure relates to substrate processing, and more particularly to systems and methods for adding and removing sacrificial protective layers to environmentally sensitive surfaces of substrates. Background technique [0004] The background description provided herein is for the purpose of generally presenting the context of the disclosure. The work of the presently named inventors is neither expressly nor impliedly admitted to be prior art to the present disclosure to the extent that it is described in this Background section and in aspects of the specification that cannot be determined to ...

Claims

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Application Information

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IPC IPC(8): H01L21/56C09D5/16H01L21/02
CPCH01L21/67115H01L21/6715H01L21/67028H01L21/02057H01L21/56C09D5/16H01L21/02118H01L21/02282H01L21/02348H01L21/02299H01L21/02307H01L21/30625
Inventor 史蒂芬·M·施瑞德拉莎娜·莉玛丽潘阳戴安·海姆斯
Owner LAM RES CORP