Semiconductor crystal bar tumbling mill machine tool

Abstract

The invention provides a semiconductor crystal bar tumbling mill machine tool. The machine tool comprises a machine tool base, a cross beam located above the machine tool base, a Z-axis feeding sliding table mounted on the cross beam, a Z-axis driving device driving the Z-axis feeding sliding table to move, a clamp set mounted at the bottom of the Z-axis feeding sliding table, a feeding guide rail mounted on the machine tool base, a feeding conveying sliding table, a detection sliding table and a driving mechanism which are mounted on the feeding guide rail, a feeding centering device mounted on the feeding conveying sliding table, a blank detection device and an X-ray crystal orientation detector arranged on the detection sliding table, a crystal bar grinding device mounted on the machine tool base, and a machining detection device mounted on the crystal bar grinding device. According to the machine tool, automatic machining, mechanical feeding and mechanical detection are achieved, the grinding frequency is determined, manual operation is reduced, and the work efficiency and the work precision are improved.

Description

technical field [0001] The invention relates to the technical field of silicon rod processing, in particular to a semiconductor crystal rod rolling machine tool. Background technique [0002] At present, semiconductor ingot roller mills widely used in the market are mostly processed by manual loading, clamping, alignment, and testing. This kind of manual loading and unloading, manual inspection to determine the number of grinding times, and manual inspection of the size after a single grinding processing method, on the premise of ensuring the processing quality, the processing efficiency is low. And according to the level of the operator and the difference in the detection method, the consistency of the ingot processing is poor. [0003] Moreover, the existing tumbling machine has a large footprint due to many mechanical parts. Contents of the invention [0004] According to the above technical problems, a semiconductor ingot rolling machine tool is provided. [0005] T...

AI Technical Summary

Problems solved by technology

This kind of processing method of manual loading and unloading, manual detection to determine the number of grinding, and manual detection of size after a single grinding, under the premise of ensuring the processing quality, the processing efficiency is low

And according to the level of the operator, the difference in the detection method, the consistency of the ingot processing is poor

[0003] Moreover, the existing tumbling machine has a large footprint due to many mechanical parts.

Images