Heat dissipation patch for M2 solid state disk

Abstract

The invention discloses a heat dissipation patch applied to a notebook computer, a desktop computer or an external M2 solid state disk. The heat dissipation patch comprises a thin porous foam metal copper layer, a bidirectional regular hexagon array heat dissipation layer, a specially-processed fixed copper sheet and a silica gel insulation pad. Various structural sizes are designed for the M2 solid state disk in the market, and the design of the efficient bidirectional regular hexagonal array heat dissipation layer and the like is utilized to realize the combination of light weight and efficient heat dissipation. And the fixed copper sheet plays a role of supporting and a reference surface. The silica gel heat-conducting insulation pad is connected with the user M2 solid state disk, so that the effects of bonding, buffering and electrostatic shielding can be achieved, and the contact thermal resistance between heat-conducting solid surfaces can be reduced. The heat dissipation patch is easy to install, the heat dissipation capacity of the hard disk can be greatly enhanced and the working temperature can be greatly reduced only by tightly attaching the heat dissipation patch to the hard disk by a user, the compression resistance and bending resistance of the M2 hard disk of the user can be improved, and the heat dissipation patch is light and easy to install.

Description

technical field [0001] The invention relates to the technical field of computer components and mobile storage, in particular to a solid-state hard disk with a size of 22×80mm and an M2 interface. Background technique [0002] With the rapid development of information technology and the popularization of big data applications, people have put forward higher requirements for storage capacity, storage speed, integrity and flexibility of stored data. The M2 solid-state drive is a memory that uses a semiconductor chip as a storage medium, and it mainly includes two protocols, NVME and SATA. Because this type of solid-state hard disk does not contain mechanical parts, its access speed is several times or even dozens of times higher than that of traditional mechanical hard disks. Solid-state hard drives have the advantages of fast read and write speed, low power consumption, small size, and wide working range. Currently, notebook computers are the most prominent personal computers...

AI Technical Summary

Problems solved by technology

However, if the existing technical solutions are applied to the heat dissipation of M2 solid-state drives, there are the following problems: From the perspective of the connection between the heat dissipation components and the implementation of the scheme, the above-mentioned mostly uses spot welding on the surface of the copper plate to complete the fixation, and the heat dissipation structure layer and the insulation layer cannot be realized. Effective insulation, and due to the narrow structure, it is difficult to process

In practical applications, for example, the space of the solid-state hard disk slot of a notebook computer is generally small, and a little carelessness may cause the above-mentioned metal-based copper-clad laminate heat dissipation structure to contact the motherboard or other components to cause a short circuit, causing irreparable losses to the computer; from the size On the other hand, its heat dissipation components are limited by the volume of the combined configuration structure, and it is difficult to make the thin and light size that meets the requirements of heat dissipation stickers. It is difficult to use on solid state drives and is not easy for users to install and carry. At the design level, the existing technology cannot effectively reduce the contact thermal resistance and thin the temperature boundary layer, or the degree of heat transfer enhancement is not obvious enough, and the heat transfer coefficient is small in a small space, etc., and the hexagonal heat dissipation structure is not adopted or used to a certain extent. Insufficient, so that the design of the above heat dissipation scheme cannot efficiently dissipate the heat generated by the M2 solid state drive when it is working

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